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EPO-TEK® H61ND
| Category: | Epoxy , Epoxy; Epoxide |
| Manufacturer: | Epoxy Technology Inc. |
| Trademark: | EPO-TEK® |
| Fillers: | - |
| Ports: | Qinzhou, Shekou, Shanghai, Ningbo |
| Delivery Terms | FOB, CIF, DAP, DAT, DDP |
| PDF: | WFZGwi_EPO-TEK-H61ND.pdf  |
| PRICE: | Order Products email sales@su-jiao.com |
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| A single component, high Tg, thermally conductive, electrically insulating epoxy adhesive for semiconductor, microelectronic, and opto-electronic packaging applications. |
| General Information | |
|---|---|
| Features |
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| Uses |
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| Agency Ratings |
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| RoHS Compliance |
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| Forms |
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| Physical | Nominal Value | Unit | |
|---|---|---|---|
| Ion Type | |||
| Cl- | 90 | ppm | |
| K+ | 17 | ppm | |
| Na+ | 142 | ppm | |
| NH4+ | 392 | ppm | |
| Particle Size | < 50.0 | µm |
| Additional Information | Nominal Value | Unit | |
|---|---|---|---|
| Degradation Temperature | 468 | °C | |
| Die Shear Strength - >20 kg (23°C) | 46.9 | MPa | |
| Operating Temperature | |||
| Continuous | -55 to 200 | °C | |
| Intermittent | -55 to 300 | °C | |
| Storage Modulus (23°C) | 6.15 | GPa | |
| Thixotropic Index | 1.30 | ||
| Weight Loss on Heating | |||
| 200°C | 0.080 | % | |
| 250°C | 0.14 | % | |
| 300°C | 0.24 | % |
| Thermal | Nominal Value | Unit | |
|---|---|---|---|
| Glass Transition Temperature 1 | > 100 | °C | |
| CLTE - Flow | |||
| -- 2 | 2.2E-5 | cm/cm/°C | |
| -- 3 | 8.6E-5 | cm/cm/°C | |
| Thermal Conductivity | 0.80 | W/m/K |
| Thermoset | Nominal Value | Unit | |
|---|---|---|---|
| Shelf Life 4 | 26 | wk |
| Uncured Properties | Nominal Value | Unit | |
|---|---|---|---|
| Color | Grey, Light | ||
| Density | 2.26 | g/cm³ | |
| Viscosity 5(23°C) | 30 to 50 | Pa·s | |
| Curing Time (150°C) | 1.0 | hr | |
| Pot Life | 29000 | min |
| Cured Properties | Nominal Value | Unit | |
|---|---|---|---|
| Shore Hardness (Shore D) | 83 | ||
| Lap Shear Strength (23°C) | 3.49 | MPa | |
| Relative Permittivity (1 kHz) | 4.23 | ||
| Volume Resistivity (23°C) | > 3.0E+13 | ohms·cm | |
| Dissipation Factor (1 kHz) | 3.0E-3 |
| Note Message | |
|---|---|
| 1 . | Dynamic Cure 20-200°C/ISO 25 Min; Ramp -10-200°C @ 20°C/Min |
| 2 . | Below Tg |
| 3 . | Above Tg |
| 4 . | Refrigerated |
| 5 . | 5 rpm |
| Resin Grade | Manufacturer | Category | Trademark |
|---|---|---|---|
| TIPELIN® FS 383-03 | MOL Petrochemicals Co. Ltd. | MDPE | TIPELIN® |
| CP PRYME® Polycarbonate PC100RULUV-10M Clear | Chase Plastics Services Inc. | PC | CP PRYME® Polycarbonate |
| EMOPLEN® A 830 T15 | EMAS Plastik San.Tic.AS. | PP, Unspecified | EMOPLEN® |
| Iupilon® GSH2010KR | Mitsubishi Engineering-Plastics Corp | PC | Iupilon® |
| LNP™ THERMOCOMP™ PF006S compound | SABIC Innovative Plastics | Nylon 6 | LNP™ THERMOCOMP™ |
