TECACOMP® PPA LDS black 4109

Category: PPA , Polyphthalamide
Manufacturer: Ensinger GmbH
Trademark: TECACOMP®
Fillers: -
Ports: Qinzhou, Shekou, Shanghai, Ningbo
Delivery Terms FOB, CIF, DAP, DAT, DDP
PDF: VFxZXY_TECACOMPPPALDSblack4109.pdf
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Main features
  • developed for the LPKF-LDS® process
  • high thermal conductivity

Target Industries
  • automotive industry
  • electrical engineering
  • LED lighting technology
  • mechanical engineering
General Information
Features
  • Heat conduction
Uses
  • Laser Direct Structuring
  • LEDs
  • Lighting Applications
  • Application in Automobile Field
Appearance
  • Black
Forms
  • Particles
Processing Method
  • Injection molding
PhysicalNominal ValueUnitTest Method
Density 1.54g/cm³
Melt Mass-Flow Rate (MFR) (300°C/5.0 kg)32g/10 minISO 1133
Melt Volume-Flow Rate (MVR) (300°C/5.0 kg)20.6cm³/10minISO 1133
Molding Shrinkage ISO 294-4
    Transverse flow 0.60%ISO 294-4
    Flow 0.60%ISO 294-4
Water Absorption (Equilibrium, 23°C, 50% RH)< 0.10%ISO 62
MechanicalNominal ValueUnitTest Method
Tensile Modulus 9000MPaISO 527-2/50
Tensile Stress 43.0MPaISO 527-2/50
Tensile Strain (Break)0.50%ISO 527-2/50
ImpactNominal ValueUnitTest Method
Charpy Unnotched Impact Strength 5.0kJ/m²ISO 179/1eU
ThermalNominal ValueUnitTest Method
Heat Deflection Temperature (1.8 MPa, Unannealed)222°CISO 75-2/A
Glass Transition Temperature 100 - 140°CDIN 53765
Melting Temperature 285 - 315°CDIN 53765
Linear thermal expansion coefficient ISO 11359-2
    Flow : 50 to 100°C 3.3E-5cm/cm/°CISO 11359-2
    Flow : 100 to 150°C 5.3E-5cm/cm/°CISO 11359-2
    Flow : 150 to 200°C 7.7E-5cm/cm/°CISO 11359-2
    Horizontal : 50 to 100°C 3.4E-5cm/cm/°CISO 11359-2
    Horizontal : 100 to 150°C 5.9E-5cm/cm/°CISO 11359-2
    Horizontal : 150 to 200°C 9.4E-5cm/cm/°CISO 11359-2
Specific Heat 1090J/kg/°CDIN EN 821
Thermal Conductivity DIN EN 821
    -- 11.3W/m/KDIN EN 821
    -- 24.3W/m/KDIN EN 821
Service Temperature
    long term 150°C
    short term 250°C
Thermal Diffusivity DIN EN 821
    In-plane 2.53cStDIN EN 821
    Through-plane 0.770cStDIN EN 821
Additional InformationNominal ValueUnit
Adhesion Strength - metal path 20.2MPa
Lazer Marking
    Forward moving 2.0 - 3.0m/sec
    Frequency 100 - 200kHz
    Power 2.00 - 6.00Watts
ElectricalNominal ValueUnitTest Method
Surface Resistivity 4.7E+12ohmsDIN EN 61340
Volume Resistivity 5.2E+13ohms·cmDIN EN 61340
Comparative Tracking Index 600VIEC 60112
FlammabilityNominal ValueUnitTest Method
Flammability Classification HBIEC 60695-11-10, -20
InjectionNominal ValueUnit
Drying Temperature 100°C
Drying Time 2.0 - 3.0hr
Suggested Max Moisture 0.10%
Processing (Melt) Temp 320 - 340°C
Mold Temperature 150 - 170°C
Note Message
1 .Through-plane
2 .In-plane
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