EPO-TEK® OD1001

Category: Epoxy , Epoxy; Epoxide
Manufacturer: Epoxy Technology Inc.
Trademark: EPO-TEK®
Fillers: -
Ports: Qinzhou, Shekou, Shanghai, Ningbo
Delivery Terms FOB, CIF, DAP, DAT, DDP
PDF: UziIkU_EPO-TEK-OD1001.pdf
PRICE: ​Order Products​ email   sales@su-jiao.com
Wechat: WECHAT
Message
A single component, thermally and electrically insulating epoxy designed for low stress semiconductor and electronics packaging. Low Tg, several weeks of pot life and low modulus are a few of it traits. It is particularly suitable for bonding, sealing and potting ferrite cores in power device plastic packaging.
General Information
Features
  • Electrically Insulating
  • Thermally Insulating
Uses
  • Bonding
  • Electrical/Electronic Applications
  • Seals
Agency Ratings
  • EC 1907/2006 (REACH)
  • EU 2003/11/EC
  • EU 2006/122/EC
RoHS Compliance
  • RoHS Compliant
Forms
  • Paste
Processing Method
  • Potting
PhysicalNominal ValueUnit
Particle Size < 10.0µm
Additional InformationNominal ValueUnit
Degradation Temperature 355°C
Die Shear Strength - >15 kg (23°C) 35.2MPa
Operating Temperature
    Continuous -55 to 175°C
    Intermittent -55 to 275°C
Storage Modulus 1.16GPa
Thixotropic Index 1.20
Weight Loss on Heating
    200°C 0.27%
    250°C 0.64%
    300°C 1.5%
ThermalNominal ValueUnit
Glass Transition Temperature 1> 35.0°C
CLTE - Flow
    -- 26.6E-5cm/cm/°C
    -- 32.1E-4cm/cm/°C
OpticalNominal ValueUnit
Refractive Index 41.541
Transmittance (300 to 1200 nm)< 50.0%
ThermosetNominal ValueUnit
Shelf Life (-40°C)52wk
Uncured PropertiesNominal ValueUnit
Color Cream
Density 1.13g/cm³
Viscosity 5(23°C)1.0 to 1.5Pa·s
Curing Time (125°C)1.0hr
Pot Life 40000min
Cured PropertiesNominal ValueUnit
Shore Hardness (Shore D)70
Lap Shear Strength (23°C)> 12.4MPa
Relative Permittivity (1 kHz)3.05
Volume Resistivity (23°C)> 2.0E+13ohms·cm
Dissipation Factor (1 kHz)0.011
Note Message
1 .Dynamic Cure 20-200°C/ISO 25 Min; Ramp -10-200°C @ 20°C/Min
2 .Below Tg
3 .Above Tg
4 .589 nm
5 .100 rpm
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