| Category: | Epoxy , Epoxy; Epoxide |
| Manufacturer: | Epoxy Technology Inc. |
| Trademark: | EPO-TEK® |
| Fillers: | - |
| Ports: | Qinzhou, Shekou, Shanghai, Ningbo |
| Delivery Terms | FOB, CIF, DAP, DAT, DDP |
| PDF: | UziIkU_EPO-TEK-OD1001.pdf |
| PRICE: | Order Products email sales@su-jiao.com |
| Message |
|---|
| A single component, thermally and electrically insulating epoxy designed for low stress semiconductor and electronics packaging. Low Tg, several weeks of pot life and low modulus are a few of it traits. It is particularly suitable for bonding, sealing and potting ferrite cores in power device plastic packaging. |
| General Information | |
|---|---|
| Features |
|
| Uses |
|
| Agency Ratings |
|
| RoHS Compliance |
|
| Forms |
|
| Processing Method |
|
| Physical | Nominal Value | Unit | |
|---|---|---|---|
| Particle Size | < 10.0 | µm |
| Additional Information | Nominal Value | Unit | |
|---|---|---|---|
| Degradation Temperature | 355 | °C | |
| Die Shear Strength - >15 kg (23°C) | 35.2 | MPa | |
| Operating Temperature | |||
| Continuous | -55 to 175 | °C | |
| Intermittent | -55 to 275 | °C | |
| Storage Modulus | 1.16 | GPa | |
| Thixotropic Index | 1.20 | ||
| Weight Loss on Heating | |||
| 200°C | 0.27 | % | |
| 250°C | 0.64 | % | |
| 300°C | 1.5 | % |
| Thermal | Nominal Value | Unit | |
|---|---|---|---|
| Glass Transition Temperature 1 | > 35.0 | °C | |
| CLTE - Flow | |||
| -- 2 | 6.6E-5 | cm/cm/°C | |
| -- 3 | 2.1E-4 | cm/cm/°C |
| Optical | Nominal Value | Unit | |
|---|---|---|---|
| Refractive Index 4 | 1.541 | ||
| Transmittance (300 to 1200 nm) | < 50.0 | % |
| Thermoset | Nominal Value | Unit | |
|---|---|---|---|
| Shelf Life (-40°C) | 52 | wk |
| Uncured Properties | Nominal Value | Unit | |
|---|---|---|---|
| Color | Cream | ||
| Density | 1.13 | g/cm³ | |
| Viscosity 5(23°C) | 1.0 to 1.5 | Pa·s | |
| Curing Time (125°C) | 1.0 | hr | |
| Pot Life | 40000 | min |
| Cured Properties | Nominal Value | Unit | |
|---|---|---|---|
| Shore Hardness (Shore D) | 70 | ||
| Lap Shear Strength (23°C) | > 12.4 | MPa | |
| Relative Permittivity (1 kHz) | 3.05 | ||
| Volume Resistivity (23°C) | > 2.0E+13 | ohms·cm | |
| Dissipation Factor (1 kHz) | 0.011 |
| Note Message | |
|---|---|
| 1 . | Dynamic Cure 20-200°C/ISO 25 Min; Ramp -10-200°C @ 20°C/Min |
| 2 . | Below Tg |
| 3 . | Above Tg |
| 4 . | 589 nm |
| 5 . | 100 rpm |
| Resin Grade | Manufacturer | Category | Trademark |
|---|---|---|---|
| RTP 209 MS | RTP Company | Nylon 66 | RTP |
| SUNFROST® KB75GA | Mitsubishi Chemical Performance Polymers, Inc. | PVC Elastomer | SUNFROST® |
| Mafill® CR C 7041 | Ravago Group | PP Copolymer | Mafill® |
| OTECH PVC OM6525-Soles | OTECH Corporation | PVC, Unspecified | OTECH PVC |
| NYLOY® NG-0135B | Nytex Composites Co., Ltd. | Nylon 6 | NYLOY® |