Dow ENDURANCE™ HFDB-0801 BK EC Datasheet,PE Copolymer,The Dow Chemical Company-SHANGHAI SUSHENG

Message
DOW ENDURANCE™ HFDB-0801 BK EC is a vulcanizable semiconductive compound based on a polyethylene copolymer and is designed for conductor shield and bonded insulation shield applications in crosslinked polyethylene insulated medium and high voltage cables.(1) DOW ENDURANCE™ HFDB-0801 BK EC has improved processability and demonstrated compatibility with copper and aluminum conductors. DOW ENDURANCE™ HFDB-0801 BK EC was specifically developed utilizing a special acetylene carbon black to provide a super-smooth surface yielding a more perfect interface between the extruded shield and the insulation. As a result, significantly improved cable performance can be expected. DOW ENDURANCE™ HFDB-0801 BK EC is formulated with a higher temperature peroxide. Thus, DOW ENDURANCE™ HFDB-0801 BK EC is less subject to pre-cure or scorch within the processing extruder and die. Specifications DOW ENDURANCE™ HFDB-0801 BK EC is designed for use in power distribution cables. Cables with conductor and insulation shielding of DOW ENDURANCE™ HFDB-0801 BK EC, prepared using sound commercial fabrication practice, would be expected to meet the following specifications: AEIC: CS7, CS8 IEC: 60502, 60840, 62067 ICEA: S-108-720, S-94-649; S-97-682; S-93-639 (NEMA WC 74), DIN: VDE 0273

General Information
Uses	High Voltage Semiconductive Shield Semiconductive Shield Underground cable Cable guard Wire and cable applications
Agency Ratings	AEIC CS7 AEIC CS8 ICEA S-93-639 ICEA S-94-649 ICEA S-97-682 IEC 60502 IEC 60840 IEC 62067 NEMA WC-74 VDE 0273
Forms	Particle

Physical	Nominal Value	Unit	Test Method
Specific Gravity	1.05	g/cm³	ASTM D792

Hardness	Nominal Value	Unit	Test Method
Durometer Hardness (Shore D)	50		ASTM D2240

Mechanical	Nominal Value	Unit	Test Method
Tensile Modulus - 1% Secant ¹	165	MPa	ASTM D638
Tensile Strength ²	14.1	MPa	ASTM D638

Elastomers	Nominal Value	Unit	Test Method
Tensile Elongation (Break)	300	%	ASTM D412

Aging	Nominal Value	Unit	Test Method
Tensile strength retention- 1 week (150°C)	90	%	ASTM D638
Elongation retention rate- 1 week (150°C)	90	%	ASTM D412

Thermal	Nominal Value	Unit	Test Method
Brittleness Temperature	-40.0	°C	ASTM D746

Electrical	Nominal Value	Unit	Test Method
Volume Resistivity			ASTM D991
23°C	20	ohms·cm	ASTM D991
90°C	75	ohms·cm	ASTM D991
130°C	1.1E+2	ohms·cm	ASTM D991

Fill Analysis	Nominal Value	Unit	Test Method
Melt Viscosity ³			ASTM D3835
125°C, 180 sec^-1	1900	Pa·s	ASTM D3835
125°C, 360 sec^-1	1200	Pa·s	ASTM D3835
125°C, 900 sec^-1	650	Pa·s	ASTM D3835
125°C, 1800 sec^-1	420	Pa·s	ASTM D3835

Additional Information
Nominal property values above represent tests on molded stress-relieved slabs. Cure times were 15 minutes at 175°C.Extra-Clean Requirements Among many desirable characteristics, DOW ENDURANCE™ HFDB-0801 BK EC is extra-clean. While many semiconductive products contain about 0.3% sulfur and 0.1% inorganic ash, DOW ENDURANCE™ HFDB-0801 BK EC typically has less than 0.005% sulfur and less than 0.01% ash. The raw materials used for DOW ENDURANCE™ HFDB-0801 BK EC are cleaner by design than those used for conventional semiconductive materials. Additional precautions are employed during the manufacture of DOW ENDURANCE™ HFDB-0801 BK EC relative to conventional conductor shields to prevent introduction of any contamination to the raw materials and to the final product. These low levels of contamination can be expected to play a positive role in the manufacture of a totally extra-clean cable. Supersmooth Extruded Surface DOW ENDURANCE™ HFDB-0801 BK EC meets strict standards of smoothness established for a crosslinkable semiconductive shield compound. The extruded surface of DOW ENDURANCE™ HFDB-0801 BK EC must meet a smoothness specification that is more rigorous that conventional semiconductive shields. Throughout the production process, the product is tested to ensure smoothness. Extruded tapes are scanned by an automatic inspection system in a clean room. The tape smoothness data is managed using an acceptance sampling plan, which ensures that the shipping container meets or exceeds the product's smoothness standard. The DOW ENDURANCE™ HFDB-0801 BK EC smoothness standard has been designed to meet the global industry specifications for semiconductive shield materials on medium and high voltage cables. Each batch of DOW ENDURANCE HFDB-0801 BK EC meets the following smoothness requirement: Protrusion Height / Maximum Allowable 60-74 µm / 0 per m² > 75 µm / 0 per m² Storage The environment or conditions of storage greatly influences the recommended storage time. Storage should be in accordance with good manufacturing practices. If proper warehousing and storage temperatures [dry conditions, between 50°F and 86°F (10°C and 30°C) in temperature] are utilized, this product may be stored by the customer for up to one year. It is recommended that the practice of using the product on a first-in / first-out basis be established. Storage under extreme conditions may affect the quality, processing, or performance of the product.

Additional Information

Nominal property values above represent tests on molded stress-relieved slabs. Cure times were 15 minutes at 175°C.Extra-Clean Requirements Among many desirable characteristics, DOW ENDURANCE™ HFDB-0801 BK EC is extra-clean. While many semiconductive products contain about 0.3% sulfur and 0.1% inorganic ash, DOW ENDURANCE™ HFDB-0801 BK EC typically has less than 0.005% sulfur and less than 0.01% ash. The raw materials used for DOW ENDURANCE™ HFDB-0801 BK EC are cleaner by design than those used for conventional semiconductive materials. Additional precautions are employed during the manufacture of DOW ENDURANCE™ HFDB-0801 BK EC relative to conventional conductor shields to prevent introduction of any contamination to the raw materials and to the final product. These low levels of contamination can be expected to play a positive role in the manufacture of a totally extra-clean cable. Supersmooth Extruded Surface DOW ENDURANCE™ HFDB-0801 BK EC meets strict standards of smoothness established for a crosslinkable semiconductive shield compound. The extruded surface of DOW ENDURANCE™ HFDB-0801 BK EC must meet a smoothness specification that is more rigorous that conventional semiconductive shields. Throughout the production process, the product is tested to ensure smoothness. Extruded tapes are scanned by an automatic inspection system in a clean room. The tape smoothness data is managed using an acceptance sampling plan, which ensures that the shipping container meets or exceeds the product's smoothness standard. The DOW ENDURANCE™ HFDB-0801 BK EC smoothness standard has been designed to meet the global industry specifications for semiconductive shield materials on medium and high voltage cables. Each batch of DOW ENDURANCE HFDB-0801 BK EC meets the following smoothness requirement: Protrusion Height / Maximum Allowable 60-74 µm / 0 per m² > 75 µm / 0 per m² Storage The environment or conditions of storage greatly influences the recommended storage time. Storage should be in accordance with good manufacturing practices. If proper warehousing and storage temperatures [dry conditions, between 50°F and 86°F (10°C and 30°C) in temperature] are utilized, this product may be stored by the customer for up to one year. It is recommended that the practice of using the product on a first-in / first-out basis be established. Storage under extreme conditions may affect the quality, processing, or performance of the product.

Extrusion	Nominal Value	Unit
Drying Temperature	60.0 - 70.0	°C
Drying Time	< 6.0	hr
Melt Temperature	121 - 140	°C

Extrusion instructions
DOW ENDURANCE™ HFDB-0801 BK EC provides excellent surface finish and outstanding output rates over a broad range of conditions. For optimum results, use melt extrusion temperatures in the suggested range of 250 to 285°F (121 to 140°C) to avoid pre-cure or scorch. DOW ENDURANCE™ HFDB-0801 BK EC contains a high temperature peroxide and offers a broad processing latitude. Extruder barrel settings of 110°C (230°F) are suggested as a starting point while learning to process DOW ENDURANCE™ HFDB-0801 BK EC. Specific machine settings will depend on the extruder design and must be established through conventional practices. DOW ENDURANCE™ HFDB-0801 BK EC is designed for ease of processing and with viscosity within the range of DOW ENDURANCE™ HFDA-0587 BK.Dehumidified air hopper drying at 140-160°F (60-70°C) for up to six hours may be employed to remove residual moisture prior to extrusion. Drying is not necessary for DOW ENDURANCE™ HFDB-0801 BK EC due to the lower moisture absorption characteristics relative to conventional semiconductive products.

Extrusion instructions

DOW ENDURANCE™ HFDB-0801 BK EC provides excellent surface finish and outstanding output rates over a broad range of conditions. For optimum results, use melt extrusion temperatures in the suggested range of 250 to 285°F (121 to 140°C) to avoid pre-cure or scorch. DOW ENDURANCE™ HFDB-0801 BK EC contains a high temperature peroxide and offers a broad processing latitude. Extruder barrel settings of 110°C (230°F) are suggested as a starting point while learning to process DOW ENDURANCE™ HFDB-0801 BK EC. Specific machine settings will depend on the extruder design and must be established through conventional practices. DOW ENDURANCE™ HFDB-0801 BK EC is designed for ease of processing and with viscosity within the range of DOW ENDURANCE™ HFDA-0587 BK.Dehumidified air hopper drying at 140-160°F (60-70°C) for up to six hours may be employed to remove residual moisture prior to extrusion. Drying is not necessary for DOW ENDURANCE™ HFDB-0801 BK EC due to the lower moisture absorption characteristics relative to conventional semiconductive products.

Note Message
1 .	5.0 mm/min
2 .	510 mm/min
3 .	Göttfert Capillary Rheometer, D=1 mm, L=20D

Category:	PE Copolymer , Supersmooth, Extra-Clean, Crosslinkable Semiconductive Shielding Compound
Manufacturer:	The Dow Chemical Company
Trademark:	Dow ENDURANCE™
Fillers:	-
Ports:	Qinzhou, Shekou, Shanghai, Ningbo
Delivery Terms	FOB, CIF, DAP, DAT, DDP
PDF:	UlkoeO_Dow-ENDURANCE-HFDB-0801-BK-EC.pdf
PRICE:	Order Products email sales@su-jiao.com

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