Category: | Adhesive , Adhesive |
Manufacturer: | Cytec Industries Inc. |
Trademark: | CORFIL® |
Fillers: | - |
Ports: | Qinzhou, Shekou, Shanghai, Ningbo |
Delivery Terms | FOB, CIF, DAP, DAT, DDP |
PDF: | UYPvIb_CORFIL-625-1.pdf ![]() |
PRICE: | Order Products email sales@su-jiao.com |
Message |
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CORFIL® 625-1 potting compound is a one-part, low density material formulated for use in insert and edge filling of honeycomb core. It may also be used as a syntactic core splice adhesive. It is formulated to have low viscosity making it especially suitable for use with automated equipment. CORFIL 625-1 can be cured at either 250°F (121°C) or 350°F (177°C) with minimal to no exotherm in large applications. FEATURES & BENEFITS One-part pumpable material 250°F (121°C)/ 350°F (177°C) cure Minimal exotherm -67 to 350°F (-55 to 177°C) service range |
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Mechanical | Nominal Value | Unit | |
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Compressive Strength (24°C) | 20.7 to 21.4 | MPa | |
Shear Strength 1(24°C) | 6.89 to 8.27 | MPa |
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