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LNP™ THERMOCOMP™ EX93452 compound
| Category: | PEI , Polyether Imide |
| Manufacturer: | SABIC Innovative Plastics |
| Trademark: | LNP™ THERMOCOMP™ |
| Fillers: | - |
| Ports: | Qinzhou, Shekou, Shanghai, Ningbo |
| Delivery Terms | FOB, CIF, DAP, DAT, DDP |
| PDF: | UCxrGH_LNPTHERMOCOMPEX93452compound.pdf  |
| PRICE: | Order Products email sales@su-jiao.com |
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| Message |
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LNP THERMOCOMP EX93452 is a compound based on Polyetherimide resin containing Carbon Fiber. Added features of this material include: Electrically Conductive. Also known as: LNP* THERMOCOMP* Compound PDX-E-93452 Product reorder name: EX93452 |
| General Information | |
|---|---|
| Filler / Reinforcement |
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| Features |
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| Physical | Nominal Value | Unit | Test Method |
|---|---|---|---|
| Specific Gravity | 1.35 | g/cm³ | ASTM D792 |
| Mechanical | Nominal Value | Unit | Test Method |
|---|---|---|---|
| Tensile Modulus 1 | 15600 | MPa | ASTM D638 |
| Tensile Strength (Break) | 185 | MPa | ASTM D638 |
| Tensile Elongation (Break) | 1.7 | % | ASTM D638 |
| Flexural Modulus | 12200 | MPa | ASTM D790 |
| Flexural Strength | 262 | MPa | ASTM D790 |
| Impact | Nominal Value | Unit | Test Method |
|---|---|---|---|
| Notched Izod Impact (23°C) | 53 | J/m | ASTM D256 |
| Thermal | Nominal Value | Unit | Test Method |
|---|---|---|---|
| Deflection Temperature Under Load (1.8 MPa, Unannealed, 3.20 mm) | 212 | °C | ASTM D648 |
| Note Message | |
|---|---|
| 1 . | 50 mm/min |
| Resin Grade | Manufacturer | Category | Trademark |
|---|---|---|---|
| Toraycon® 1184G-A15 | Toray Resin Company | PBT | Toraycon® |
| Cheng Yu A701BK | Cheng Yu Plastic Company Limited | ABS | Cheng Yu |
| Formolene® HP3902 | Formosa Plastics Corporation, U.S.A. | MDPE | Formolene® |
| Elastron® G G500.A45.B.PS | Elastron USA, Inc. | SEBS | Elastron® G |
| Plasmer 7065B/8901 | HYUNDAI EP Co., Ltd. | TPE | Plasmer |
