CELEX™ 501.C

Category: PC+ABS , PC/ABS Engineering Resin
Manufacturer: Trinseo
Trademark: CELEX™
Fillers: -
Ports: Qinzhou, Shekou, Shanghai, Ningbo
Delivery Terms FOB, CIF, DAP, DAT, DDP
PDF: TpCBml_CELEX-501-C.pdf
PRICE: ​Order Products​ email   sales@su-jiao.com
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Message
CELEX 501.C is a high flow PC/ABS alloy. It combines the superior physical properties, high heat resistance of PC and the excellent processability of ABS. CELEX 501.C is designed for use in thin wall injection products and mobile phone housing.
General Information
Features
  • Good Processability
  • High Flow
  • High Heat Resistance
Forms
  • Pellets
PhysicalNominal ValueUnitTest Method
Specific Gravity 1.12g/cm³ASTM D792
Melt Mass-Flow Rate (MFR) ASTM D1238
    230°C/3.8 kg 8.3g/10 min
    250°C/5.0 kg 30g/10 min
    260°C/5.0 kg 36g/10 min
Molding Shrinkage - Flow (3.20 mm)0.40 to 0.60%ASTM D955
MechanicalNominal ValueUnitTest Method
Tensile Strength (Yield, 3.20 mm)50.0MPaASTM D638
Flexural Modulus (3.20 mm)2260MPaASTM D790
Flexural Strength (3.20 mm)84.0MPaASTM D790
ImpactNominal ValueUnitTest Method
Notched Izod Impact (23°C, 3.20 mm)540J/mASTM D256
ThermalNominal ValueUnitTest Method
Deflection Temperature Under Load (1.8 MPa, Unannealed, 3.20 mm)100°CASTM D648
FlammabilityNominal ValueTest Method
Flame Rating 1(0.800 mm)HBUL 94
InjectionNominal ValueUnit
Drying Temperature 80.0°C
Drying Time 3.0 to 4.0hr
Rear Temperature 215 to 230°C
Middle Temperature 230 to 235°C
Front Temperature 235 to 240°C
Nozzle Temperature 240 to 250°C
Mold Temperature 40.0 to 60.0°C
Note Message
1 .This rating not intended to reflect hazards presented by this or any other material under actual fire conditions.
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