Order Products : sales@su-jiao.com
EPO-TEK® H22
| Category: | Epoxy , Epoxy; Epoxide |
| Manufacturer: | Epoxy Technology Inc. |
| Trademark: | EPO-TEK® |
| Fillers: | - |
| Ports: | Qinzhou, Shekou, Shanghai, Ningbo |
| Delivery Terms | FOB, CIF, DAP, DAT, DDP |
| PDF: | TeFgC1_EPO-TEK-H22.pdf  |
| PRICE: | Order Products email sales@su-jiao.com |
Wechat:
| Message |
|---|
| EPO-TEK® H22 is a two component, silver-filled epoxy system designed specifically for die bonding and sealing hybrid circuit packages. |
| General Information | |
|---|---|
| Filler / Reinforcement |
|
| Features |
|
| Uses |
|
| Agency Ratings |
|
| RoHS Compliance |
|
| Forms |
|
| Physical | Nominal Value | Unit | |
|---|---|---|---|
| Ion Type | |||
| Cl- | 175 | ppm | |
| K+ | 6 | ppm | |
| Na+ | 60 | ppm | |
| NH4+ | 148 | ppm | |
| Particle Size | < 45.0 | µm |
| Additional Information | Nominal Value | Unit | Test Method |
|---|---|---|---|
| Degradation Temperature | 454 | °C | TGA |
| Die Shear Strength - >5 kg (23°C) | 11.7 | MPa | |
| Operating Temperature | |||
| Continuous | -55 to 250 | °C | |
| Intermittent | -55 to 350 | °C | |
| Storage Modulus (23°C) | 3.72 | GPa | |
| Thixotropic Index | 2.36 | ||
| Weight Loss on Heating | |||
| 200°C | 0.090 | % | |
| 250°C | 0.23 | % | |
| 300°C | 0.42 | % |
| Thermal | Nominal Value | Unit | |
|---|---|---|---|
| Glass Transition Temperature 1 | > 100 | °C | |
| CLTE - Flow | |||
| -- 2 | 3.9E-5 | cm/cm/°C | |
| -- 3 | 2.2E-4 | cm/cm/°C | |
| Thermal Conductivity | 0.94 | W/m/K |
| Thermoset | Nominal Value | Unit | Test Method |
|---|---|---|---|
| Thermoset Components | |||
| Part A | Mix Ratio by Weight: 100 | ||
| Part B | Mix Ratio by Weight: 4.5 | ||
| Shelf Life (23°C) | 52 | wk |
| Uncured Properties | Nominal Value | Unit | Test Method |
|---|---|---|---|
| Color | |||
| -- 4 | Amber | ||
| -- 5 | Silver | ||
| Density | |||
| Part B | 1.03 | g/cm³ | |
| Part A | 2.02 | g/cm³ | |
| Viscosity 6(23°C) | 12 to 20 | Pa·s | |
| Curing Time (150°C) | 1.0 | hr | |
| Pot Life | 960 | min |
| Cured Properties | Nominal Value | Unit | Test Method |
|---|---|---|---|
| Shore Hardness (Shore D) | 80 | ||
| Lap Shear Strength (23°C) | 13.7 | MPa | |
| Volume Resistivity (23°C) | < 5.0E-3 | ohms·cm |
| Note Message | |
|---|---|
| 1 . | Dynamic Cure 20-200°C/ISO 25 Min; Ramp -10-200°C @ 20°C/Min |
| 2 . | Below Tg |
| 3 . | Above Tg |
| 4 . | Part B |
| 5 . | Part A |
| 6 . | 20 rpm |
| Resin Grade | Manufacturer | Category | Trademark |
|---|---|---|---|
| TES J-50/20 GY8134 | Techmer Engineered Solutions | PC | TES |
| Epoxies, Ect. 20-2180 | Epoxies, Etc. | PUR, Unspecified | Epoxies, Ect. |
| Hanwha Total PE 620L | HANWHA TOTAL PETROCHEMICALS Co., Ltd. | LDPE | Hanwha Total PE |
| Jiangsu Sinarise EX9025X | Jiangsu Sinarise New Material Technology Co., Ltd | TPE | Jiangsu Sinarise |
| LG ABS XR410 | LG Chem Ltd. | ABS | LG ABS |
