EPO-TEK® H22

Category: Epoxy , Epoxy; Epoxide
Manufacturer: Epoxy Technology Inc.
Trademark: EPO-TEK®
Fillers: -
Ports: Qinzhou, Shekou, Shanghai, Ningbo
Delivery Terms FOB, CIF, DAP, DAT, DDP
PDF: TeFgC1_EPO-TEK-H22.pdf
PRICE: ​Order Products​ email   sales@su-jiao.com
Wechat: WECHAT
Message
EPO-TEK® H22 is a two component, silver-filled epoxy system designed specifically for die bonding and sealing hybrid circuit packages.
General Information
Filler / Reinforcement
  • Silver
Features
  • Electrically Conductive
  • Fast Cure
  • Good Chemical Resistance
  • Low to No Outgassing
  • Moisture Resistant
  • Solvent Resistant
  • Thixotropic
Uses
  • Adhesives
  • Bonding
  • Electrical/Electronic Applications
  • High Temperature Applications
  • Seals
Agency Ratings
  • ASTM E 595
  • EC 1907/2006 (REACH)
  • EU 2003/11/EC
  • EU 2006/122/EC
RoHS Compliance
  • RoHS Compliant
Forms
  • Paste
PhysicalNominal ValueUnit
Ion Type
    Cl- 175ppm
    K+ 6ppm
    Na+ 60ppm
    NH4+ 148ppm
Particle Size < 45.0µm
Additional InformationNominal ValueUnitTest Method
Degradation Temperature 454°CTGA
Die Shear Strength - >5 kg (23°C) 11.7MPa
Operating Temperature
    Continuous -55 to 250°C
    Intermittent -55 to 350°C
Storage Modulus (23°C) 3.72GPa
Thixotropic Index 2.36
Weight Loss on Heating
    200°C 0.090%
    250°C 0.23%
    300°C 0.42%
ThermalNominal ValueUnit
Glass Transition Temperature 1> 100°C
CLTE - Flow
    -- 23.9E-5cm/cm/°C
    -- 32.2E-4cm/cm/°C
Thermal Conductivity 0.94W/m/K
ThermosetNominal ValueUnitTest Method
Thermoset Components
    Part A Mix Ratio by Weight: 100
    Part B Mix Ratio by Weight: 4.5
Shelf Life (23°C)52wk
Uncured PropertiesNominal ValueUnitTest Method
Color
    -- 4Amber
    -- 5Silver
Density
    Part B 1.03g/cm³
    Part A 2.02g/cm³
Viscosity 6(23°C)12 to 20Pa·s
Curing Time (150°C)1.0hr
Pot Life 960min
Cured PropertiesNominal ValueUnitTest Method
Shore Hardness (Shore D)80
Lap Shear Strength (23°C)13.7MPa
Volume Resistivity (23°C)< 5.0E-3ohms·cm
Note Message
1 .Dynamic Cure 20-200°C/ISO 25 Min; Ramp -10-200°C @ 20°C/Min
2 .Below Tg
3 .Above Tg
4 .Part B
5 .Part A
6 .20 rpm
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