Order Products : sales@su-jiao.com
EPO-TEK® H63
| Category: | Epoxy , Epoxy; Epoxide |
| Manufacturer: | Epoxy Technology Inc. |
| Trademark: | EPO-TEK® |
| Fillers: | - |
| Ports: | Qinzhou, Shekou, Shanghai, Ningbo |
| Delivery Terms | FOB, CIF, DAP, DAT, DDP |
| PDF: | SgubMg_EPO-TEK-H63.pdf  |
| PRICE: | Order Products email sales@su-jiao.com |
Wechat:
| Message |
|---|
| A single component, electrically insulating, thermally conductive epoxy adhesive for semiconductor, hybrid packaging and electronic circuit assembly applications. It is a higher viscosity alternative to EPO-TEK® H62. |
| General Information | |
|---|---|
| Features |
|
| Uses |
|
| Agency Ratings |
|
| RoHS Compliance |
|
| Forms |
|
| Physical | Nominal Value | Unit | |
|---|---|---|---|
| Particle Size | < 50.0 | µm |
| Additional Information | Nominal Value | Unit | |
|---|---|---|---|
| Degradation Temperature | 418 | °C | |
| Die Shear Strength - >10 kg (23°C) | 23.4 | MPa | |
| Operating Temperature | |||
| Continuous | -55 to 250 | °C | |
| Intermittent | -55 to 350 | °C | |
| Storage Modulus (23°C) | 3.21 | GPa | |
| Thixotropic Index | 1.13 | ||
| Weight Loss on Heating | |||
| 200°C | 0.050 | % | |
| 250°C | 0.19 | % | |
| 300°C | 0.66 | % |
| Thermal | Nominal Value | Unit | |
|---|---|---|---|
| Glass Transition Temperature 1 | > 120 | °C | |
| CLTE - Flow | |||
| -- 2 | 2.7E-5 | cm/cm/°C | |
| -- 3 | 1.3E-4 | cm/cm/°C | |
| Thermal Conductivity | 0.56 | W/m/K |
| Thermoset | Nominal Value | Unit | |
|---|---|---|---|
| Shelf Life 4 | 52 | wk |
| Uncured Properties | Nominal Value | Unit | |
|---|---|---|---|
| Color | Black | ||
| Density | 1.79 | g/cm³ | |
| Viscosity 5(23°C) | 25 to 35 | Pa·s | |
| Curing Time (150°C) | 1.0 | hr | |
| Pot Life | 40000 | min |
| Cured Properties | Nominal Value | Unit | |
|---|---|---|---|
| Shore Hardness (Shore D) | 91 | ||
| Lap Shear Strength (23°C) | 7.60 | MPa | |
| Relative Permittivity (1 kHz) | 4.75 | ||
| Volume Resistivity (23°C) | > 3.0E+13 | ohms·cm | |
| Dissipation Factor (1 kHz) | 0.021 |
| Note Message | |
|---|---|
| 1 . | Dynamic Cure 20-200°C/ISO 25 Min; Ramp -10-200°C @ 20°C/Min |
| 2 . | Below Tg |
| 3 . | Above Tg |
| 4 . | Refrigerated |
| 5 . | 10 rpm |
| Resin Grade | Manufacturer | Category | Trademark |
|---|---|---|---|
| Sinelec CCB6115 | Teknor Apex Asia Pacific PTE. LTD. | PS (Specialty) | Sinelec |
| MTM® 249 | Cytec Industries Inc. | Epoxy | MTM® |
| Addisil™ 6300 | Momentive Performance Materials Inc. | Silicone | Addisil™ |
| Dutral® TER 4038 PL | Versalis S.p.A. | EPDM | Dutral® |
| Lushan PR320 | Guangzhou Lushan New Materials Co., Ltd | PP, Unspecified | Lushan |
