Epiall® 1960B-1

Category: Epoxy , Epoxy; Epoxide
Manufacturer: Sumitomo Bakelite North America, Inc.
Trademark: Epiall®
Fillers: -
Ports: Qinzhou, Shekou, Shanghai, Ningbo
Delivery Terms FOB, CIF, DAP, DAT, DDP
PDF: R3mY9w_Epiall-1960B-1.pdf
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Epiall 1960B-1 is a mineral and short fiberglass filled epoxy compound, formulated for the encapsulation of passive electronic devices.
General Information
Filler / Reinforcement
  • Glass Fiber
  • Mineral
Uses
  • Electrical/Electronic Applications
Appearance
  • Black
Forms
  • Granules
Processing Method
  • Compression Molding
  • Encapsulating
  • Resin Transfer Molding
PhysicalNominal ValueUnitTest Method
Specific Gravity 1.76g/cm³ASTM D792
Molding Shrinkage - Flow (Compression Molded)0.30 to 0.50%ASTM D955
Water Absorption - 48 hr (50°C)0.20%ASTM D570
MechanicalNominal ValueUnitTest Method
Tensile Strength (Break, Compression Molded)80.0MPaASTM D638
Flexural Modulus (Compression Molded)12400MPaASTM D790
Flexural Strength (Break)115MPaASTM D790
Compressive Strength 242MPaASTM D695
ImpactNominal ValueUnitTest Method
Notched Izod Impact (Compression Molded)37J/mASTM D256
ThermalNominal ValueUnitTest Method
Deflection Temperature Under Load (1.8 MPa, Annealed, Compression Molded)275°CASTM D648
ElectricalNominal ValueUnitTest Method
Dielectric Strength 1ASTM D149
    -- 215kV/mm
    -- 313kV/mm
Dielectric Constant 4(1 MHz)4.00ASTM D2520
Dissipation Factor 5(1 MHz)0.019ASTM D150
Arc Resistance 180secASTM D495
Note Message
1 .Wet, 60 Hz
2 .Method A (Short-Time)
3 .Method B (Step-by-Step)
4 .Wet
5 .Wet
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