EPO-TEK® OG116-31

Category: Epoxy , Epoxy; Epoxide
Manufacturer: Epoxy Technology Inc.
Trademark: EPO-TEK®
Fillers: -
Ports: Qinzhou, Shekou, Shanghai, Ningbo
Delivery Terms FOB, CIF, DAP, DAT, DDP
PDF: QxsqcY_EPO-TEK-OG116-31.pdf
PRICE: ​Order Products​ email   sales@su-jiao.com
Wechat: WECHAT
Message
EPO-TEK® OG116-31 is a single component, UV curable epoxy adhesive and encapsulant, designed for PCB and circuit assembly applications found in semiconductor, computer, medical, and scientific/OEM industries.
General Information
Features
  • Biocompatible
  • Low to No Outgassing
  • UV Curable
Uses
  • Adhesives
  • Electrical/Electronic Applications
  • LCD Applications
  • Medical/Healthcare Applications
  • Printed Circuit Boards
Agency Ratings
  • EC 1907/2006 (REACH)
  • EU 2003/11/EC
  • EU 2006/122/EC
  • USP Class VI
RoHS Compliance
  • RoHS Compliant
Forms
  • Liquid
Processing Method
  • Encapsulating
PhysicalNominal ValueUnit
Particle Size < 20.0µm
Additional InformationNominal ValueUnit
Degradation Temperature 409°C
Die Shear Strength - >10 kg (23°C) 23.4MPa
Operating Temperature
    Continuous -55 to 200°C
    Intermittent -55 to 300°C
Storage Modulus 1.82GPa
Thixotropic Index 1.30
Weight Loss on Heating
    200°C 0.31%
    250°C 0.68%
    300°C 1.2%
ThermalNominal ValueUnit
Glass Transition Temperature 1> 115°C
CLTE - Flow
    -- 24.1E-5cm/cm/°C
    -- 31.7E-4cm/cm/°C
OpticalNominal ValueUnit
Refractive Index
    -- 41.567
    -- 51.584
Transmittance
    500 nm > 92.0%
    660 to 1640 nm > 96.0%
ThermosetNominal ValueUnit
Shelf Life (23°C)52wk
Uncured PropertiesNominal ValueUnit
Color White
Density 1.20g/cm³
Viscosity 6(23°C)20 to 30Pa·s
Cured PropertiesNominal ValueUnit
Shore Hardness (Shore D)83
Note Message
1 .Dynamic Cure 20-200°C/ISO 25 Min; Ramp -10-200°C @ 20°C/Min
2 .Below Tg
3 .Above Tg
4 .589 nm (uncured)
5 .589 nm (cured)
6 .10 rpm
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