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BR® 624
| Category: | Epoxy , Epoxy; Epoxide |
| Manufacturer: | Cytec Industries Inc. |
| Trademark: | BR® |
| Fillers: | - |
| Ports: | Qinzhou, Shekou, Shanghai, Ningbo |
| Delivery Terms | FOB, CIF, DAP, DAT, DDP |
| PDF: | QgouOk_BR-624.pdf  |
| PRICE: | Order Products email sales@su-jiao.com |
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BR® 624 potting compound is a one-part, low density material formulated for use in insert or edge filling of honeycomb sandwich construction. It is a thermosetting, modified epoxy system, serviceable over a temperature range of -70 to 350°F (-57 to 177°C). BR 624 potting compound is thixotropic and cure cycles may be varied over a broad range. Cure temperatures as low as 225°F (107°C) and as high as 350°F (177°C) have been used successfully. Multiple cure cycles at temperatures up to 350°F (177°C) will not impair its use as a structural material. Suggested Applications: Insert and edge filling of honeycomb structures |
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| Physical | Nominal Value | Unit | |
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| Specific Gravity 1 | 0.650 | g/cm³ |
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| 1 . | Approximate |
| Resin Grade | Manufacturer | Category | Trademark |
|---|---|---|---|
| Sanren Y180L (Premium-grade) | SINOPEC Shanghai Petrochemical Co. Ltd. | PP Homopolymer | Sanren |
| RTP 1099 X 63347 | RTP Company | PBT | RTP |
| Braskem PE EF2002 | Braskem | LDPE | Braskem PE |
| Deco-Coat™ DC-2510 | Epoxies, Etc. | Epoxy | Deco-Coat™ |
| AURUM® JCF3030 | Mitsui Chemicals, Inc. | PI, TP | AURUM® |
