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KYOCERA KE-G1270

Category:	Epoxy , Epoxy; Epoxide
Manufacturer:	KYOCERA Chemical Corporation
Trademark:	KYOCERA
Fillers:	-
Ports:	Qinzhou, Shekou, Shanghai, Ningbo
Delivery Terms	FOB, CIF, DAP, DAT, DDP
PDF:	QR3Feq_KYOCERA-KE-G1270.pdf
PRICE:	Order Products email sales@su-jiao.com

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Message

Special Epoxy Molding Compounds Optimizing Warpage and Applicable to Fine Pitch Wire for BGA Package

Strong Points

Less Warpage in All Types of Area Array Packages due to High Tg Characteristic.

Applicable to Fine Pitch Wire Bonding with Good Wire Sweep Performance.

Achieve High Yield after Molding due to Excellent Moldability that allows its application to MAP.

Application

Standard P-BGA, HS-BGA and LGA Package.

Multi Chip Module (Stacked or Side by Side Layout)

IC Card, Memory Card etc.

Low Alpha Ray Type: KE-G2270

General Information
Features	Good Moldability
Uses	Electrical/Electronic Applications

Physical	Nominal Value	Unit
Specific Gravity	2.00	g/cm³
Spiral Flow	160	cm
Solution Viscosity	8000	mPa·s

Mechanical	Nominal Value	Unit
Flexural Modulus	20000	MPa
Flexural Strength	140	MPa

Thermal	Nominal Value	Unit
Glass Transition Temperature	180	°C
CLTE - Flow
-- ¹	1.0E-5	cm/cm/°C
-- ²	4.2E-5	cm/cm/°C

Note Message
1 .	Alpha 1
2 .	Alpha 2

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