| Category: | PP Homopolymer , Polypropylene Homopolymer |
| Manufacturer: | SO.F.TER. SPA |
| Trademark: | Polifor® |
| Fillers: | - |
| Ports: | Qinzhou, Shekou, Shanghai, Ningbo |
| Delivery Terms | FOB, CIF, DAP, DAT, DDP |
| PDF: | QPkcLF_Polifor-20-TE-20-H-D-GRIGIO-7185.pdf |
| PRICE: | Order Products email sales@su-jiao.com |
| Message |
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| Polypropylene homopolymer, 20% mineral filled, heat and detergent stabilized |
| General Information | |
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| Filler / Reinforcement |
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| Additive |
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| Features |
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| Uses |
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| Agency Ratings |
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| Appearance |
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| Processing Method |
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| Physical | Nominal Value | Unit | Test Method |
|---|---|---|---|
| Specific Gravity | 1.06 | g/cm³ | ASTM D792 |
| Melt Mass-Flow Rate (MFR) (230°C/2.16 kg) | 18 | g/10 min | ASTM D1238 |
| Molding Shrinkage | 1.2 | % | Internal Method |
| Mechanical | Nominal Value | Unit | Test Method |
|---|---|---|---|
| Tensile Strength (Yield) | 30.0 | MPa | ASTM D638 |
| Tensile Elongation (Break) | 20 | % | ASTM D638 |
| Flexural Modulus | 2000 | MPa | ASTM D790 |
| Impact | Nominal Value | Unit | Test Method |
|---|---|---|---|
| Notched Izod Impact (23°C) | 30 | J/m | ASTM D256 |
| Thermal | Nominal Value | Unit | Test Method |
|---|---|---|---|
| Vicat Softening Temperature | 97.0 | °C | ASTM D1525 1 |
| Flammability | Nominal Value | Test Method | |
|---|---|---|---|
| Flame Rating | UL 94 | ||
| 1.60 mm | HB | ||
| 3.20 mm | HB |
| Injection | Nominal Value | Unit | |
|---|---|---|---|
| Drying Temperature | 80.0 | °C | |
| Drying Time | 3.0 | hr | |
| Rear Temperature | 190 | °C | |
| Middle Temperature | 210 | °C | |
| Front Temperature | 230 | °C | |
| Mold Temperature | 40.0 to 60.0 | °C |
| Note Message | |
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| 1 . | Rate A (50°C/h), Loading 2 (50 N) |
| Resin Grade | Manufacturer | Category | Trademark |
|---|---|---|---|
| SABIC® PPcompound 9135 | Saudi Basic Industries Corporation (SABIC) | PP, Unspecified | SABIC® PPcompound |
| ALCOM® PP 620/8 GF/MRX | ALBIS PLASTIC GmbH | PP, Unspecified | ALCOM® PP |
| CET® 250 | Resirene, S.A. de C.V. | Acrylic (SMMA) | CET® |
| FORMULA P COMP 5220 | Putsch Kunststoffe GmbH | PP, Unspecified | FORMULA P |
| Plaskon LS-16 | Cookson Electronics - Semiconductor Products | Epoxy | Plaskon |