NEMCON H ES DP110/X3

Category: PC Alloy , Polycarbonate Alloy
Manufacturer: Ovation Polymers Inc.
Trademark: NEMCON H
Fillers: -
Ports: Qinzhou, Shekou, Shanghai, Ningbo
Delivery Terms FOB, CIF, DAP, DAT, DDP
PDF: OUvOAW_NEMCON-H-ES-DP110-X3.pdf
PRICE: ​Order Products​ email   sales@su-jiao.com
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Message
Nemcon™ H-series products are designed for use in high performance electronic assemblies where heat removal is critical to system performance. Nemcon™ H ES DP110/X3 is a thermally conductive polycarbonate alloy, combining good thermal conductivity with improved HDT and processability relative to conventional polycarbonate compounds.
General Information
Features
  • Heat conduction
  • Workability, good
  • Heat resistance, high
Uses
  • Electrical/Electronic Applications
  • Electrical components
  • Electrical housing
  • High temperature application
  • Shell
Forms
  • Particle
PhysicalNominal ValueUnitTest Method
Specific Gravity 1.49g/cm³ASTM D792
MechanicalNominal ValueUnitTest Method
Tensile Modulus 1(23°C)3180MPaASTM D638
Tensile Strength 2(Break, 23°C)47.0MPaASTM D638
Tensile Elongation 3(Break, 23°C)1.7%ASTM D638
Flexural Modulus 4(23°C, 50.0 mm Span)7350MPaASTM D790
Flexural Strength 5(Break, 23°C, 50.0 mm Span)75.0MPaASTM D790
ImpactNominal ValueUnitTest Method
Notched Izod Impact (23°C)19J/mASTM D256
ThermalNominal ValueUnitTest Method
Deflection Temperature Under Load (1.8 MPa, Unannealed, 3.20 mm)113°CASTM D648
Thermal Conductivity (23°C)3.5W/m/KASTM C177
ElectricalNominal ValueUnitTest Method
Surface Resistivity 8.0E+12ohmsASTM D257
Additional Information
The value listed as Thermal Conductivity, ASTM C177 was tested in accordance with ASTM E1461.
Note Message
1 .50 mm/min
2 .50 mm/min
3 .50 mm/min
4 .1.3 mm/min
5 .1.3 mm/min
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