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Ablefilm ECF561E
| Category: | Epoxy , Epoxy; Epoxide |
| Manufacturer: | Henkel Ablestik |
| Trademark: | Ablefilm |
| Fillers: | - |
| Ports: | Qinzhou, Shekou, Shanghai, Ningbo |
| Delivery Terms | FOB, CIF, DAP, DAT, DDP |
| PDF: | O82God_Ablefilm-ECF561E.pdf  |
| PRICE: | Order Products email sales@su-jiao.com |
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| Message |
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| ABLEFILM® ECF561E electrically conductive die attach adhesive is designed for bonding materials with severely mismatched coefficients of thermal expansion. When used for substrate attach, this adhesive film acts as an electrical ground plane. |
| General Information | |
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| Filler / Reinforcement |
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| Features |
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| Uses |
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| Appearance |
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| Thermal | Nominal Value | Unit | Test Method |
|---|---|---|---|
| Glass Transition Temperature | 47.0 | °C | DSC |
| CLTE - Flow | ASTM D696 | ||
| < 47°C | 1.0E-4 | cm/cm/°C | |
| > 47°C | 3.8E-4 | cm/cm/°C | |
| Thermal Conductivity (121°C) | 1.6 | W/m/K |
| Thermoset | Nominal Value | Unit | |
|---|---|---|---|
| Shelf Life (-40°C) | 52 | wk | |
| Post Cure Time | |||
| 125°C | 2.0 | hr | |
| 150°C | 1.0 | hr |
| Additional Information | Nominal Value | Unit | |
|---|---|---|---|
| Bond Joint Resistance | 0.00200 | ohms/in² | |
| Carrier Resin | Glass fabric | ||
| Lap Shear | |||
| Al to Al | 13.8 | MPa | |
| Au to Au | 14.5 | MPa | |
| Weight Loss on Heating (300°C) | 0.55 | % |
| Resin Grade | Manufacturer | Category | Trademark |
|---|---|---|---|
| Moplen HP640T | LyondellBasell Industries | PP Homopolymer | Moplen |
| XIRAN® SM200 | Polyscope Polymers BV | SMA | XIRAN® |
| NANCAR® 1082 | Nantex Industry Co., Ltd. | NBR | NANCAR® |
| Durolon® VR2500 CR010 | Unigel Plásticos | PC | Durolon® |
| EPLAMID 6 GCV2 20 NC | EPSAN Plastik SAN. ve TiC. A.S. | Nylon 6 | EPLAMID 6 |
