Category: | Epoxy , Epoxy; Epoxide |
Manufacturer: | Vyncolit N.V. |
Trademark: | Vyncolit® |
Fillers: | - |
Ports: | Qinzhou, Shekou, Shanghai, Ningbo |
Delivery Terms | FOB, CIF, DAP, DAT, DDP |
PDF: | NY23AB_Vyncolit-2008.pdf ![]() |
PRICE: | Order Products email sales@su-jiao.com |
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Vyncolit 2008 is a kind of epoxy. Epoxy resin material contains glass fiber reinforced material. This product is available in North America, Africa and the Middle East, Latin America, Europe or Asia Pacific. The processing methods are: resin transfer molding, compression molding or injection molding. The main features of the Vyncolit 2008 are:
Typical application areas include:
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Processing Method |
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Physical | Nominal Value | Unit | Test Method |
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Specific Gravity | 1.85 | g/cm³ | ASTM D792 |
Bulk Factor | 2.5 | ASTM D1895 | |
Molding Shrinkage - Flow (Compression Molded) | 0.30 - 0.50 | % | ASTM D955 |
Hardness | Nominal Value | Unit | Test Method |
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Barcol Hardness | 72 | ASTM D2583 |
Mechanical | Nominal Value | Unit | Test Method |
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Tensile Strength | 62.1 | MPa | ASTM D638 |
Flexural Modulus | 15200 | MPa | ASTM D790 |
Flexural Strength | 124 | MPa | ASTM D790 |
Compressive Strength | 207 | MPa | ASTM D695 |
Impact | Nominal Value | Unit | Test Method |
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Notched Izod Impact | 35 | J/m | ASTM D256A |
Thermal | Nominal Value | Unit | Test Method |
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Deflection Temperature Under Load (1.8 MPa, Unannealed) | 260 | °C | ASTM D648 |
CLTE - Flow | 3.7E-5 | cm/cm/°C | ASTM D696 |
Thermal Conductivity | 0.69 | W/m/K | ASTM C177 |
Electrical | Nominal Value | Unit | Test Method |
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Dielectric Strength 1 | 12 | kV/mm | ASTM D149 |
Dielectric Constant (1 MHz) | 4.00 | ASTM D150 | |
Dissipation Factor (1 MHz) | 0.019 | ASTM D150 | |
Arc Resistance | 180 | sec | ASTM D495 |
Flammability | Nominal Value | Unit | Test Method |
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Oxygen Index | 50 | % | ASTM D2863 |
Injection | Nominal Value | Unit | |
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Middle Temperature | 60.0 - 82.2 | °C | |
Nozzle Temperature | 82.2 - 93.3 | °C | |
Processing (Melt) Temp | 93.3 - 116 | °C | |
Mold Temperature | 149 - 177 | °C | |
Injection Pressure | 34.5 - 68.9 | MPa | |
Holding Pressure | 13.8 - 34.5 | MPa | |
Back Pressure | 0.345 | MPa |
Injection instructions |
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Gauge: 0.3The value listed as Thermal Conductivity, ASTM C177, was tested in accordance with ASTM F433.Water Absorption, ASTM D570, 48 hrs, 50°C: 0.2%Dielectric Strength, ASTM D149, 60 Hz, Method B, wet: 310 V/milDielectric Constant, ASTM D150, 1000000 Hz, wet: 4Dissipation Factor, ASTM D150, 1000000 Hz, wet: 0.019Bulk Factor, ASTM D1895: 2 to 3Compression and Transfer Molding Conditions: Preheat Temperature: 180 to 225 °F Mold Temperature: 325 to 370 °F Compression Mold Pressure: 1000 to 5000 psi Transfer Mold Pressure: 1500 to 8000 psi Cure Time, 0.125 in: 60 to 90 sec |
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1 . | Method B (step by step) |
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