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NEXT SIGNATURE PC EG-100
| Category: | PC , Polycarbonate |
| Manufacturer: | NEXT Specialty Resins, Inc. |
| Trademark: | NEXT SIGNATURE |
| Fillers: | - |
| Ports: | Qinzhou, Shekou, Shanghai, Ningbo |
| Delivery Terms | FOB, CIF, DAP, DAT, DDP |
| PDF: | NRYTFh_NEXT-SIGNATURE-PC-EG-100.pdf  |
| PRICE: | Order Products email sales@su-jiao.com |
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NEXT SIGNATURE PC EG-100 is a Polycarbonate (PC) material. It is available in North America. Primary attribute of NEXT SIGNATURE PC EG-100: Halogen Free. Typical applications include:
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| Physical | Nominal Value | Unit | Test Method |
|---|---|---|---|
| Specific Gravity | 1.20 | g/cm³ | ASTM D792 |
| Melt Mass-Flow Rate (MFR) | 3.0 | g/10 min | ASTM D1238 |
| Hardness | Nominal Value | Unit | Test Method |
|---|---|---|---|
| Rockwell Hardness (M-Scale) | 70 | ASTM D785 |
| Mechanical | Nominal Value | Unit | Test Method |
|---|---|---|---|
| Tensile Strength | 59.3 | MPa | ASTM D638 |
| Tensile Elongation (Break) | 80 | % | ASTM D638 |
| Flexural Modulus | 2070 | MPa | ASTM D790 |
| Thermal | Nominal Value | Unit | Test Method |
|---|---|---|---|
| Deflection Temperature Under Load (1.8 MPa, Unannealed) | 131 | °C | ASTM D648 |
| Resin Grade | Manufacturer | Category | Trademark |
|---|---|---|---|
| RIALFILL H 07 S 40 MJ | RIALTI Srl | PP Homopolymer | RIALFILL |
| SureSpec HD55-30 | Genesis Polymers | HDPE | SureSpec |
| Vydyne® R550H NT662 | Ascend Performance Materials Operations LLC | Nylon 66 | Vydyne® |
| Geon™ Vinyl Wire & Cable WJKC306 | PolyOne Corporation | PVC, Flexible | Geon™ Vinyl Wire & Cable |
| MAGNUM™ MATT | Trinseo | ABS | MAGNUM™ |
