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NEXT SIGNATURE PC EG-100
| Category: | PC , Polycarbonate |
| Manufacturer: | NEXT Specialty Resins, Inc. |
| Trademark: | NEXT SIGNATURE |
| Fillers: | - |
| Ports: | Qinzhou, Shekou, Shanghai, Ningbo |
| Delivery Terms | FOB, CIF, DAP, DAT, DDP |
| PDF: | NRYTFh_NEXT-SIGNATURE-PC-EG-100.pdf  |
| PRICE: | Order Products email sales@su-jiao.com |
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NEXT SIGNATURE PC EG-100 is a Polycarbonate (PC) material. It is available in North America. Primary attribute of NEXT SIGNATURE PC EG-100: Halogen Free. Typical applications include:
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| Physical | Nominal Value | Unit | Test Method |
|---|---|---|---|
| Specific Gravity | 1.20 | g/cm³ | ASTM D792 |
| Melt Mass-Flow Rate (MFR) | 3.0 | g/10 min | ASTM D1238 |
| Hardness | Nominal Value | Unit | Test Method |
|---|---|---|---|
| Rockwell Hardness (M-Scale) | 70 | ASTM D785 |
| Mechanical | Nominal Value | Unit | Test Method |
|---|---|---|---|
| Tensile Strength | 59.3 | MPa | ASTM D638 |
| Tensile Elongation (Break) | 80 | % | ASTM D638 |
| Flexural Modulus | 2070 | MPa | ASTM D790 |
| Thermal | Nominal Value | Unit | Test Method |
|---|---|---|---|
| Deflection Temperature Under Load (1.8 MPa, Unannealed) | 131 | °C | ASTM D648 |
| Resin Grade | Manufacturer | Category | Trademark |
|---|---|---|---|
| Megalon® 100L | Mega Polymers | Nylon 66 | Megalon® |
| Telcar® DE 5052 | Teknor Apex Asia Pacific PTE. LTD. | TPE | Telcar® |
| Yuyao PBT 3020G30 | Yuyao Tenglong Plastics Co., Ltd. | PBT | Yuyao PBT |
| Boda BDT-LG3701 | Chenguang Fluoro & Silicone Elastomers Co., Ltd. | Fluorelastomer | Boda |
| ALTECH® PC B 2010/100 | ALBIS PLASTIC GmbH | PC | ALTECH® PC |
