Di-Pak™ R-4545/40

Category: TP, Unspecified , Thermoplastic
Manufacturer: Hapco Inc.
Trademark: Di-Pak™
Fillers: -
Ports: Qinzhou, Shekou, Shanghai, Ningbo
Delivery Terms FOB, CIF, DAP, DAT, DDP
PDF: NGa2ag_Di-Pak-R-4545-40.pdf
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DI-PAK R-4545 Series
A very low viscosity potting and encapsulating system with excellent flow and penetration into the most intricate electronic components, without voids or porosity. The R-4545 Series cure to a hard, shiny, high gloss, plastic finish that is free from "blushing" under all humidity conditions. The R-4545 Series is ideal for electrical applications where surface finish and appearance are critical.
General Information
Features
  • Blush Resistant
  • Electrically Insulating
  • Good Processability
  • Good Toughness
  • High Flow
  • High Gloss
  • High Heat Resistance
  • Low Viscosity
  • Pleasing Surface Appearance
Uses
  • Battery Cases
  • Electrical/Electronic Applications
  • Power Cable Shields
  • Switches
Appearance
  • Black
Forms
  • Liquid
Processing Method
  • Encapsulating
  • Potting
PhysicalNominal ValueUnitTest Method
Specific Gravity 1.09g/cm³ASTM D4669
Molding Shrinkage - Flow 0.10 to 0.30%ASTM D2566
Weight - per cubic inch 18g
ThermalNominal ValueUnit
Service Temperature 80°C
ThermosetNominal ValueUnitTest Method
Gel Time 1(25°C)30.0minASTM D2971
HardnessNominal ValueUnitTest Method
Durometer Hardness (Shore D)85ASTM D2240
MechanicalNominal ValueUnitTest Method
Tensile Modulus 2490MPaASTM D638
Tensile Strength 43.1MPaASTM D638
Tensile Elongation (Break)13%ASTM D638
Flexural Modulus 2900MPaASTM D790
Flexural Strength 54.1MPaASTM D790
ImpactNominal ValueUnitTest Method
Notched Izod Impact 31J/mASTM D256
Unnotched Izod Impact 49J/mASTM D256
ThermalNominal ValueUnit
Thermal Conductivity 0.22W/m/K
ElectricalNominal ValueUnitTest Method
Volume Resistivity 7.3E+13ohms·cmASTM D257
Dielectric Strength 25kV/mmASTM D149
Dielectric Constant ASTM D150
    1 kHz 4.70
    100 kHz 4.40
Dissipation Factor (25°C, 100 kHz)0.011ASTM D150
ThermosetNominal ValueUnitTest Method
Thermoset Components
    Part A Mix Ratio by Weight: 100, Mix Ratio by Volume: 100
    Part B Mix Ratio by Weight: 43, Mix Ratio by Volume: 50
Thermoset Mix Viscosity (25°C)1100cPASTM D4878
Demold Time (21°C)1400min
Note Message
1 .100 g
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