Epiall® 1961B Datasheet,Epoxy,Vyncolit N.V.-SHANGHAI SUSHENG

Message
Epiall 1961B is a mineral and short fiberglass filled epoxy compound, formulated for the encapsulation of passive electronic devices.

General Information
Filler / Reinforcement	Glass \Mineral
Features	The degassing effect is low to no Low viscosity Solvent resistance Anti-salt water/fog Good thermal shock resistance Good chemical resistance alkali resistance acid resistance Non-corrosive
Uses	Electrical components Military application
Agency Ratings	FDA not rated USDA Unspecified Approval
Appearance	Black Blue Green
Forms	Particles
Processing Method	Resin transfer molding Compression molding Injection molding

Physical	Nominal Value	Unit	Test Method
Specific Gravity	1.90	g/cm³	ASTM D792
Molding Shrinkage - Flow (Compression Molded)	0.20 - 0.40	%	ASTM D955

Hardness	Nominal Value	Unit	Test Method
Barcol Hardness	65		ASTM D2583

Mechanical	Nominal Value	Unit	Test Method
Tensile Strength (Break, Compression Molded)	59.0	MPa	ASTM D638
Flexural Modulus (Compression Molded)	14500	MPa	ASTM D790
Flexural Strength (Break)	124	MPa	ASTM D790
Compressive Strength	221	MPa	ASTM D695

Impact	Nominal Value	Unit	Test Method
Notched Izod Impact (Compression Molded)	35	J/m	ASTM D256

Thermal	Nominal Value	Unit	Test Method
Deflection Temperature Under Load (1.8 MPa, Unannealed, Compression Molded)	260	°C	ASTM D648
CLTE - Flow	3.8E-5	cm/cm/°C	ASTM E831
Thermal Conductivity	0.67	W/m/K	ASTM C177

Electrical	Nominal Value	Unit	Test Method
Dielectric Strength ¹	13	kV/mm	ASTM D149
Dielectric Constant (1 MHz)	3.60		ASTM D150
Dissipation Factor (1 MHz)	0.019		ASTM D150
Arc Resistance	180	sec	ASTM D495

Flammability	Nominal Value	Unit	Test Method
Oxygen Index	34	%	ASTM D2863

Injection	Nominal Value	Unit
Middle Temperature	60.0 - 82.2	°C
Nozzle Temperature	82.2 - 93.3	°C
Processing (Melt) Temp	104 - 116	°C
Mold Temperature	135 - 177	°C
Injection Pressure	34.5 - 68.9	MPa
Holding Pressure	13.8 - 34.5	MPa
Back Pressure	0.345	MPa

Injection instructions
Gauge: 0.3The value listed as Thermal Conductivity, ASTM C177, was tested in accordance with ASTM C518.Water Absorption, ASTM D570, 48 hrs, 50°C: 0.2%DTUL @264psi - Unannealed, ASTM D648, Post Baked, Compression Molded: 260°CDielectric Strength, ASTM D149, 60 Hz, Method B, wet: 12.8 kV/mmDielectric Constant, ASTM D150, 1000000 Hz, wet: 3.6Dissipation Factor, ASTM D150, 1000000 Hz, wet: 0.019Compression and Transfer Molding Conditions: Preheat Temperature: 180 to 220 °F Mold Temperature: 250 to 530 °F Compression Mold Pressure: 200 to 1500 psi Transfer Mold Pressure: 100 to 2000 psi Cure Time, 0.125 in: 75 sec

Injection instructions

Gauge: 0.3The value listed as Thermal Conductivity, ASTM C177, was tested in accordance with ASTM C518.Water Absorption, ASTM D570, 48 hrs, 50°C: 0.2%DTUL @264psi - Unannealed, ASTM D648, Post Baked, Compression Molded: 260°CDielectric Strength, ASTM D149, 60 Hz, Method B, wet: 12.8 kV/mmDielectric Constant, ASTM D150, 1000000 Hz, wet: 3.6Dissipation Factor, ASTM D150, 1000000 Hz, wet: 0.019Compression and Transfer Molding Conditions: Preheat Temperature: 180 to 220 °F Mold Temperature: 250 to 530 °F Compression Mold Pressure: 200 to 1500 psi Transfer Mold Pressure: 100 to 2000 psi Cure Time, 0.125 in: 75 sec

Note Message
1 .	Method B (step by step)

Category:	Epoxy , Epoxy; Epoxide
Manufacturer:	Vyncolit N.V.
Trademark:	Epiall®
Fillers:	-
Ports:	Qinzhou, Shekou, Shanghai, Ningbo
Delivery Terms	FOB, CIF, DAP, DAT, DDP
PDF:	MG34Fu_Epiall-1961B.pdf
PRICE:	Order Products email sales@su-jiao.com

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