EPO-TEK® TV2001

Category: Epoxy , Epoxy; Epoxide
Manufacturer: Epoxy Technology Inc.
Trademark: EPO-TEK®
Fillers: -
Ports: Qinzhou, Shekou, Shanghai, Ningbo
Delivery Terms FOB, CIF, DAP, DAT, DDP
PDF: MEfTIK_EPO-TEK-TV2001.pdf
PRICE: ​Order Products​ email   sales@su-jiao.com
Wechat: WECHAT
Message
A two component, thermally conductive, electrically insulating epoxy designed for low stress semiconductor and electronics packaging. Low Tg, moderate pot-life, snap-curing and very low modulus are a few of its traits. It is particularly suitable for bonding ferrite cores in power device plastic packaging. Excellent adhesion to PCBs, ceramics, most metals and lead-frames. Also available in a frozen syringe.


Formerly 300-180-1-4
General Information
Features
  • Electrically Insulating
  • Good Adhesion
  • Thermally Conductive
Uses
  • Adhesives
  • Bonding
  • Electrical/Electronic Applications
Agency Ratings
  • EC 1907/2006 (REACH)
  • EU 2003/11/EC
  • EU 2006/122/EC
RoHS Compliance
  • RoHS Compliant
Forms
  • Paste
PhysicalNominal ValueUnit
Particle Size < 20.0µm
Additional InformationNominal ValueUnit
Degradation Temperature 466°C
Die Shear Strength - >15 kg (23°C) 35.2MPa
Operating Temperature
    Continuous -55 to 225°C
    Intermittent -55 to 325°C
Storage Modulus (23°C) 112MPa
Thixotropic Index 1.95
Weight Loss on Heating
    200°C 0.080%
    250°C 0.17%
    300°C 0.35%
ThermalNominal ValueUnit
Glass Transition Temperature 1> 15.0°C
CLTE - Flow
    -- 26.7E-5cm/cm/°C
    -- 31.9E-4cm/cm/°C
Thermal Conductivity 0.40W/m/K
ThermosetNominal ValueUnit
Thermoset Components
    Part A Mix Ratio by Weight: 100
    Part B Mix Ratio by Weight: 6.0
Shelf Life (23°C)52wk
Uncured PropertiesNominal ValueUnit
Color
    -- 4White
    -- 5Yellow
Density
    Part B 0.988g/cm³
    Part A 1.45g/cm³
Viscosity 6(23°C)10 to 20Pa·s
Pot Life 2900min
Cured PropertiesNominal ValueUnit
Shore Hardness (Shore D)45
Lap Shear Strength (23°C)> 13.8MPa
Relative Permittivity (1 kHz)3.42
Volume Resistivity (23°C)> 8.0E+12ohms·cm
Dissipation Factor (1 kHz)0.016
Note Message
1 .Dynamic Cure 20-200°C/ISO 25 Min; Ramp -10-200°C @ 20°C/Min
2 .Below Tg
3 .Above Tg
4 .Part A
5 .Part B
6 .20 rpm
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