Category: | Epoxy , Epoxy; Epoxide |
Manufacturer: | Epoxy Technology Inc. |
Trademark: | EPO-TEK® |
Fillers: | - |
Ports: | Qinzhou, Shekou, Shanghai, Ningbo |
Delivery Terms | FOB, CIF, DAP, DAT, DDP |
PDF: | MEfTIK_EPO-TEK-TV2001.pdf ![]() |
PRICE: | Order Products email sales@su-jiao.com |
Message |
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A two component, thermally conductive, electrically insulating epoxy designed for low stress semiconductor and electronics packaging. Low Tg, moderate pot-life, snap-curing and very low modulus are a few of its traits. It is particularly suitable for bonding ferrite cores in power device plastic packaging. Excellent adhesion to PCBs, ceramics, most metals and lead-frames. Also available in a frozen syringe. Formerly 300-180-1-4 |
General Information | |
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Features |
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Uses |
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Agency Ratings |
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RoHS Compliance |
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Physical | Nominal Value | Unit | |
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Particle Size | < 20.0 | µm |
Additional Information | Nominal Value | Unit | |
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Degradation Temperature | 466 | °C | |
Die Shear Strength - >15 kg (23°C) | 35.2 | MPa | |
Operating Temperature | |||
Continuous | -55 to 225 | °C | |
Intermittent | -55 to 325 | °C | |
Storage Modulus (23°C) | 112 | MPa | |
Thixotropic Index | 1.95 | ||
Weight Loss on Heating | |||
200°C | 0.080 | % | |
250°C | 0.17 | % | |
300°C | 0.35 | % |
Thermal | Nominal Value | Unit | |
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Glass Transition Temperature 1 | > 15.0 | °C | |
CLTE - Flow | |||
-- 2 | 6.7E-5 | cm/cm/°C | |
-- 3 | 1.9E-4 | cm/cm/°C | |
Thermal Conductivity | 0.40 | W/m/K |
Thermoset | Nominal Value | Unit | |
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Thermoset Components | |||
Part A | Mix Ratio by Weight: 100 | ||
Part B | Mix Ratio by Weight: 6.0 | ||
Shelf Life (23°C) | 52 | wk |
Uncured Properties | Nominal Value | Unit | |
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Color | |||
-- 4 | White | ||
-- 5 | Yellow | ||
Density | |||
Part B | 0.988 | g/cm³ | |
Part A | 1.45 | g/cm³ | |
Viscosity 6(23°C) | 10 to 20 | Pa·s | |
Pot Life | 2900 | min |
Cured Properties | Nominal Value | Unit | |
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Shore Hardness (Shore D) | 45 | ||
Lap Shear Strength (23°C) | > 13.8 | MPa | |
Relative Permittivity (1 kHz) | 3.42 | ||
Volume Resistivity (23°C) | > 8.0E+12 | ohms·cm | |
Dissipation Factor (1 kHz) | 0.016 |
Note Message | |
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1 . | Dynamic Cure 20-200°C/ISO 25 Min; Ramp -10-200°C @ 20°C/Min |
2 . | Below Tg |
3 . | Above Tg |
4 . | Part A |
5 . | Part B |
6 . | 20 rpm |
Resin Grade | Manufacturer | Category | Trademark |
---|---|---|---|
RTP 2501 | RTP Company | PC+ABS | RTP |
TEREZ PA 6 7510 GF 15 | TER HELL PLASTIC GMBH | Nylon 6 | TEREZ PA 6 |
Yanshan PE LD100 | SINOPEC Beijing Yanshan Petrochemical | LDPE | Yanshan PE |
Hostacom X M2 U43 | LyondellBasell Industries | PP Copolymer | Hostacom |
Sylvin 8878-80 White 1300 | Sylvin Technologies Incorporated | PVC, Unspecified | Sylvin |