Category: | Epoxy , Epoxy; Epoxide |
Manufacturer: | Epoxy Technology Inc. |
Trademark: | EPO-TEK® |
Fillers: | - |
Ports: | Qinzhou, Shekou, Shanghai, Ningbo |
Delivery Terms | FOB, CIF, DAP, DAT, DDP |
PDF: | KcSycn_EPO-TEK-H70E-2LC.pdf ![]() |
PRICE: | Order Products email sales@su-jiao.com |
Message |
---|
A two component, thermally conductive, electrically insulating epoxy designed for glob-top chip protection in TAB and COB die-attach technologies. It is used to prevent chips from being mechanically damaged during micro-package assembly and handling. |
General Information | |
---|---|
Features |
|
Uses |
|
Agency Ratings |
|
RoHS Compliance |
|
Forms |
|
Physical | Nominal Value | Unit | |
---|---|---|---|
Ion Type - Cl- | 194 | ppm | |
Particle Size | < 50.0 | µm |
Additional Information | Nominal Value | Unit | |
---|---|---|---|
Degradation Temperature | 400 | °C | |
Die Shear Strength - >10 kg (23°C) | 23.4 | MPa | |
Operating Temperature | |||
Continuous | -55 to 175 | °C | |
Intermittent | -55 to 350 | °C | |
Storage Modulus (23°C) | 6.37 | GPa | |
Thixotropic Index | 3.26 | ||
Weight Loss on Heating (250°C) | 0.67 | % |
Thermal | Nominal Value | Unit | |
---|---|---|---|
Glass Transition Temperature 1 | > 60.0 | °C | |
CLTE - Flow | |||
-- 2 | 1.8E-5 | cm/cm/°C | |
-- 3 | 7.5E-5 | cm/cm/°C | |
Thermal Conductivity | 0.79 | W/m/K |
Thermoset | Nominal Value | Unit | |
---|---|---|---|
Thermoset Components | |||
Part A | Mix Ratio by Weight: 1.0 | ||
Part B | Mix Ratio by Weight: 1.0 | ||
Shelf Life (23°C) | 52 | wk |
Uncured Properties | Nominal Value | Unit | |
---|---|---|---|
Color | |||
-- 4 | Black | ||
-- 5 | Cream | ||
Density | |||
Part A | 1.63 | g/cm³ | |
Part B | 2.30 | g/cm³ | |
Viscosity 6(23°C) | 6.5 to 9.5 | Pa·s | |
Curing Time (150°C) | 1.0 | hr | |
Pot Life | 3600 | min |
Cured Properties | Nominal Value | Unit | |
---|---|---|---|
Shore Hardness (Shore D) | 72 | ||
Lap Shear Strength (23°C) | 13.6 | MPa | |
Relative Permittivity (1 kHz) | 5.05 | ||
Volume Resistivity (23°C) | > 1.5E+13 | ohms·cm | |
Dissipation Factor (1 kHz) | 6.6E-3 |
Note Message | |
---|---|
1 . | Dynamic Cure 20-200°C/ISO 25 Min; Ramp -10-200°C @ 20°C/Min |
2 . | Below Tg |
3 . | Above Tg |
4 . | Part A |
5 . | Part B |
6 . | 20 rpm |
Resin Grade | Manufacturer | Category | Trademark |
---|---|---|---|
Westlake ECTFE Film | Westlake Plastics Company | ECTFE | Westlake |
Celstran® PP-GF50-0405P10/10 | Celanese Corporation | PP, Unspecified | Celstran® |
Clariant Nylon 6 PA-213M40P | Clariant Corporation | Nylon 6 | Clariant Nylon 6 |
Eastar™ EN010 | Eastman Chemical Company | Copolyester | Eastar™ |
Ebalta GH 781 / GH 781 S | Ebalta Kunststoff GmbH | Epoxy | Ebalta |