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Dow ENDURANCE™ HFDB-0586 BK S
| Category: | TP, Unspecified , Crosslinkable Semiconductive Shielding Compound with Superior Smoothness |
| Manufacturer: | The Dow Chemical Company |
| Trademark: | Dow ENDURANCE™ |
| Fillers: | - |
| Ports: | Qinzhou, Shekou, Shanghai, Ningbo |
| Delivery Terms | FOB, CIF, DAP, DAT, DDP |
| PDF: | ILxipr_DowENDURANCEHFDB0586BKS.pdf  |
| PRICE: | Order Products email sales@su-jiao.com |
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DOW ENDURANCE™ HFDB-0586 BK S is a specially formulated semiconductive, vulcanizable compound designed for conductor shield and bonded insulation shield applications in medium and high voltage crosslinked polyethylene insulated cables.(1) DOW ENDURANCE™ HFDB-0586 BK S has stable volume resistivity characteristics at elevated temperatures and is formulated with a polymer system that has demonstrated compatibility with copper and aluminum conductors. DOW ENDURANCE™HFDB-0586 BK S meets stringent requirements for product smoothness. As a conductor shield, it is designed for use up to 150 kV. As an insulation shield, it is designed for use up to 230 kV., Specifications DOW ENDURANCE™ HFDB-0586 BK S is designed for use in power distribution and transmission cables. Cables with conductor and insulation shielding of DOW ENDURANCE™ HFDB-0586 BK S, prepared using sound commercial fabrication practice, would be expected to meet the following specifications:
(1) DOW ENDURANCE™ HFDB-0586 BK S is recommended for use in conjunction with DOW cross-linked polyethylene and tree-retardant cross-linked polyethylene compounds. For other polymer insulation such as EPR and EPDM's, the user is cautioned to establish the utility of DOW ENDURANCE™ HFDB-0586 BK S with each formulation. |
| General Information | |
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| Uses |
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| Agency Ratings |
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| Forms |
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| Physical | Nominal Value | Unit | Test Method |
|---|---|---|---|
| Density | 1.10 | g/cm³ | ASTM D1505 |
| Environmental Stress-Cracking Resistance (100% Igepal, F0) | > 504 | hr | ASTM D1693 |
| Mechanical | Nominal Value | Unit | Test Method |
|---|---|---|---|
| Tensile Strength | 15.9 | MPa | ASTM D638 |
| Tensile Elongation (Break) | 300 | % | ASTM D638 |
| Aging | Nominal Value | Unit | Test Method |
|---|---|---|---|
| Tensile strength retention- 1 week (150°C) | 90 | % | ASTM D638 |
| Elongation retention rate- 1 week (150°C) | 95 | % | ASTM D638 |
| Thermal | Nominal Value | Unit | Test Method |
|---|---|---|---|
| Brittleness Temperature | -40.0 | °C | ASTM D746 |
| Electrical | Nominal Value | Unit | Test Method |
|---|---|---|---|
| Volume Resistivity | ASTM D991 | ||
| 23°C | 6.0 | ohms·cm | ASTM D991 |
| 90°C | 20 | ohms·cm | ASTM D991 |
| 130°C | 15 | ohms·cm | ASTM D991 |
| Additional Information |
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| Nominal property values above represent tests on molded stress-relieved slabs. Cure times were 15 minutes at 175°C.Storage The environment or conditions of storage greatly influences the recommended storage time. Storage should be in accordance with good manufacturing practices. If proper warehousing and storage temperatures [dry conditions, between 50°F and 86°F (10°C and 30°C) in temperature] are utilized, this product may be stored by the customer for up to one year. It is recommended that the practice of using the product on a first-in / first-out basis be established. Storage under extreme conditions may affect the quality, processing, or performance of the product. |
| Extrusion | Nominal Value | Unit | |
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| Drying Temperature | 60 - 70 | °C | |
| Drying Time | < 6.0 | hr | |
| Melt Temperature | 121 - 140 | °C |
| Extrusion instructions |
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| DOW ENDURANCE™ HFDB-0586 BK S provides excellent surface finish and outstanding output rates over a broad range of conditions. For optimum results, use melt extrusion temperatures in the suggested range of 250 to 285°F (121 to 140°C) to avoid pre-cure or scorch. Extruder barrel settings of 110°C (230°F) are suggested as a starting point while learning to process DOW ENDURANCE™ HFDB-0586 BK S. Specific machine settings will depend on the extruder design and must be established through conventional practices.Dehumidified air hopper drying at 140-160°F (60-70°C) for up to six hours may be employed to remove residual moisture prior to extrusion. Drying is not necessary for DOW ENDURANCE™ HFDB-0586 BK S due to the lower moisture absorption characteristics relative to conventional semiconductive products. |
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