Arlon® 25N

Category: PTFE , Polytetrafluoroethylene
Manufacturer: Arlon-MED
Trademark: Arlon®
Fillers: -
Ports: Qinzhou, Shekou, Shanghai, Ningbo
Delivery Terms FOB, CIF, DAP, DAT, DDP
PDF: HqtUcB_Arlon-25N.pdf
PRICE: ​Order Products​ email   sales@su-jiao.com
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Message
Arlon 25N and 25FR are woven fiberglass reinforced, ceramic-filled composite materials engineered for use in microwave and RF multilayer printed circuit boards. Combining a non-polar thermoset resin system with a controlled-expansion ceramic filler, 25N and 25FR offer low dielectric constant and loss combined with a low Thermal Coefficient of Dielectric Constant (TCEr) for signal stability over a wide ambient temperature range. Designed for use in multilayer packages, 25N and 25FR offer prepregs that are identical in chemical composition and physical properties with their copper clad laminates for a completely homogeneous finished package for optimal signal integrity.

The low dielectric constant (Er) and loss properties, low thermal coefficient of dielectric constant (TCEr), and excellent physical stability characteristics offered by 25N and 25FR materials make them ideal for wireless and digital applications, such as cellular telephones, down converters, low noise amplifiers, antennas and other advanced des ign circuits.

Processing for 25N and 25FR materials is consistent with processing for standard high temperature thermoset based printed circuit board substrates.
General Information
Filler / Reinforcement
  • Ceramic Fiber
  • Glass Fiber
Features
  • Fast Molding Cycle
  • Good Dimensional Stability
Uses
  • Electrical/Electronic Applications
Forms
  • Pellets
PhysicalNominal ValueUnitTest Method
Specific Gravity 11.70g/cm³ASTM D792A
Water Absorption 2(23°C, 24 hr)0.090%Internal Method
Volatile Matter 30.010%
FilmsNominal ValueUnitTest Method
Peel Strength 4875.6N/mInternal Method
Additional InformationNominal ValueUnit
Total Mass Loss 5(125°C)> 0.17%
Water Vapor - Recovered 0.020%
MechanicalNominal ValueUnitTest Method
Flexural Strength (23°C)208MPaASTM D790A
FilmsNominal ValueUnitTest Method
Tensile Strength - MD 6(Yield)111MPaASTM D882A
ThermalNominal ValueUnitTest Method
CLTE - Flow
    -- 71.5E-5cm/cm/°CInternal Method
    -- 85.2E-5cm/cm/°CInternal Method
Thermal Conductivity (100°C)0.45W/m/KASTM E1225
ElectricalNominal ValueUnitTest Method
Surface Resistivity 4.4E+14ohmsInternal Method
Volume Resistivity 2.0E+9ohms·cmInternal Method
Dielectric Constant 9(23°C, 10.0 GHz)3.38Internal Method
Dissipation Factor 10(10.0 GHz)2.5E-3Internal Method
Note Message
1 .23°C
2 .E1/105 + D24/23
3 .Maximum 0.10%
4 .After Thermal Stress
5 .< 10e-6 torr, Maximum 1.00%
6 .23°C
7 .Y-axis
8 .Z-axis
9 .C23/50
10 .C23/50
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