Category: | Epoxy , Epoxy; Epoxide |
Manufacturer: | Sumitomo Bakelite North America, Inc. |
Trademark: | Sumitomo Epoxy |
Fillers: | - |
Ports: | Qinzhou, Shekou, Shanghai, Ningbo |
Delivery Terms | FOB, CIF, DAP, DAT, DDP |
PDF: | H2OybO_Sumitomo-Epoxy-E-8940SG.pdf ![]() |
PRICE: | Order Products email sales@su-jiao.com |
Message |
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E 8940SG is a mineral reinforced epoxy molding compound, formulated for the encapsulation of electronic devices requiring high quality, exceptional reliability, and outstanding moldability. Typical applications include passive electronics, RC networks and rectifiers. |
General Information | |
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Features |
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Appearance |
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Processing Method |
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Physical | Nominal Value | Unit | Test Method |
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Specific Gravity | 1.80 | g/cm³ | ASTM D792 |
Apparent Density | 0.80 | g/cm³ | ASTM D1895 |
Molding Shrinkage - Flow (Compression Molded) | 0.30 to 0.50 | % | ASTM D955 |
Water Absorption - 48 hr (50°C) | 0.10 | % | ASTM D570 |
Mechanical | Nominal Value | Unit | Test Method |
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Tensile Strength (Break, Compression Molded) | 86.0 | MPa | ASTM D638 |
Flexural Modulus (Compression Molded) | 15200 | MPa | ASTM D790 |
Flexural Strength (Break) | 120 | MPa | ASTM D790 |
Compressive Strength | 240 | MPa | ASTM D695 |
Impact | Nominal Value | Unit | Test Method |
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Notched Izod Impact (Compression Molded) | 19 | J/m | ASTM D256 |
Thermal | Nominal Value | Unit | Test Method |
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Deflection Temperature Under Load (1.8 MPa, Annealed, Compression Molded) | > 225 | °C | ASTM D648 |
CLTE - Flow | 2.2E-5 | cm/cm/°C | ASTM E831 |
Thermal Conductivity | 0.72 | W/m/K | ASTM C177 |
Electrical | Nominal Value | Unit | Test Method |
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Dielectric Strength | 14 | kV/mm | ASTM D149 |
Dielectric Constant 1(1 MHz) | 3.00 | ASTM D2520 | |
Dissipation Factor 2(1 MHz) | 6.0E-3 | ASTM D150 |
Flammability | Nominal Value | Unit | Test Method |
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Flame Rating (1.60 mm) | V-0 | UL 94 |
Note Message | |
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1 . | Wet |
2 . | Wet |
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