TECACOMP® LCP LDS black 4107

Category: LCP , Liquid Crystal Polymer
Manufacturer: Ensinger GmbH
Trademark: TECACOMP®
Fillers: -
Ports: Qinzhou, Shekou, Shanghai, Ningbo
Delivery Terms FOB, CIF, DAP, DAT, DDP
PDF: GuXVnE_TECACOMPLCPLDSblack4107.pdf
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Main features
  • developed for the LPKF-LDS® process
  • low thermal expansion

Target Industries
  • automotive industry
  • electrical engineering
  • LED lighting technology
  • mechanical engineering
General Information
Features
  • Low CLTE
Uses
  • Laser Direct Structuring
  • LEDs
  • Lighting Applications
  • Application in Automobile Field
Appearance
  • Black
Forms
  • Particles
Processing Method
  • Injection molding
PhysicalNominal ValueUnitTest Method
Density 1.73g/cm³
Molding Shrinkage ISO 294-4
    Transverse flow 0.30%ISO 294-4
    Flow 0.10%ISO 294-4
Water Absorption (Equilibrium, 23°C, 50% RH)< 0.10%ISO 62
MechanicalNominal ValueUnitTest Method
Tensile Modulus 11500MPaISO 527-2/50
Tensile Stress 95.0MPaISO 527-2/50
Tensile Strain (Break)1.3%ISO 527-2/50
ImpactNominal ValueUnitTest Method
Charpy Unnotched Impact Strength 10kJ/m²ISO 179/1eU
ThermalNominal ValueUnitTest Method
Heat Deflection Temperature (1.8 MPa, Unannealed)274°CISO 75-2/A
Melting Temperature 320°CDIN 53765
Linear thermal expansion coefficient ISO 11359-2
    Flow : 50 to 100°C 1.6E-5cm/cm/°CISO 11359-2
    Flow : 100 to 150°C 2.5E-5cm/cm/°CISO 11359-2
    Flow : 150 to 200°C 3.0E-5cm/cm/°CISO 11359-2
    Flow : 200 to 250°C 3.4E-5cm/cm/°CISO 11359-2
    Horizontal : 50 to 100°C 3.2E-5cm/cm/°CISO 11359-2
    Horizontal : 100 to 150°C 4.0E-5cm/cm/°CISO 11359-2
    Horizontal : 150 to 200°C 4.9E-5cm/cm/°CISO 11359-2
    Horizontal : 200 to 250°C 6.0E-5cm/cm/°CISO 11359-2
Specific Heat 1250J/kg/°CDIN EN 821
Thermal Conductivity DIN EN 821
    -- 10.76W/m/KDIN EN 821
    -- 21.6W/m/KDIN EN 821
Service Temperature
    long term 200°C
    short term 260°C
Thermal Diffusivity DIN EN 821
    In-plane 0.930cStDIN EN 821
    Through-plane 0.310cStDIN EN 821
Additional InformationNominal ValueUnit
Adhesion Strength - metal path 9.10MPa
Lazer Marking
    Forward movement 1.6 - 3.2m/sec
    Frequency 100 - 200kHz
    Power 2.00 - 5.00Watts
ElectricalNominal ValueUnitTest Method
Surface Resistivity 4.1E+12ohmsDIN EN 61340
Volume Resistivity 3.8E+13ohms·cmDIN EN 61340
Dielectric Constant (1 kHz)4.01DIN 53483
Dissipation Factor (1 kHz)0.016DIN 53483
Comparative Tracking Index 275VIEC 60112
FlammabilityNominal ValueUnitTest Method
Flammability Classification V-0IEC 60695-11-10, -20
InjectionNominal ValueUnit
Drying Temperature 150°C
Drying Time 2.0 - 3.0hr
Processing (Melt) Temp 320 - 340°C
Mold Temperature 160°C
Note Message
1 .Through-plane
2 .In-plane
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