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NEMCON H PC DP113/X5
| Category: | PC , Polycarbonate |
| Manufacturer: | Ovation Polymers Inc. |
| Trademark: | NEMCON H |
| Fillers: | - |
| Ports: | Qinzhou, Shekou, Shanghai, Ningbo |
| Delivery Terms | FOB, CIF, DAP, DAT, DDP |
| PDF: | GS2a9E_NEMCON-H-PC-DP113-X5.pdf  |
| PRICE: | Order Products email sales@su-jiao.com |
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| Message |
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| Nemcon™ H-series products are designed for use in high performance electronic assemblies where heat removal is critical to system performance. Nemcon™ H PC DP113/X5 is a thermally conductive, electrically insulating polycarbonate compound, combining good thermal conductivity with high HDT and good processability. |
| General Information | |
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| Features |
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| Uses |
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| Forms |
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| Physical | Nominal Value | Unit | Test Method |
|---|---|---|---|
| Specific Gravity | 1.56 | g/cm³ | ASTM D792 |
| Mechanical | Nominal Value | Unit | Test Method |
|---|---|---|---|
| Tensile Modulus 1(23°C) | 2450 | MPa | ASTM D638 |
| Tensile Strength 2(Break, 23°C) | 45.0 | MPa | ASTM D638 |
| Tensile Elongation 3(Break, 23°C) | 3.5 | % | ASTM D638 |
| Flexural Modulus 4(23°C, 50.0 mm Span) | 2950 | MPa | ASTM D790 |
| Flexural Strength 5(Break, 23°C, 50.0 mm Span) | 75.0 | MPa | ASTM D790 |
| Impact | Nominal Value | Unit | Test Method |
|---|---|---|---|
| Notched Izod Impact (23°C) | 59 | J/m | ASTM D256 |
| Thermal | Nominal Value | Unit | Test Method |
|---|---|---|---|
| Deflection Temperature Under Load (1.8 MPa, Unannealed, 3.20 mm) | 124 | °C | ASTM D648 |
| Thermal Conductivity (23°C) | 1.8 | W/m/K | ASTM C177 |
| Electrical | Nominal Value | Unit | Test Method |
|---|---|---|---|
| Surface Resistivity | 1.0E+12 | ohms | ASTM D257 |
| Additional Information |
|---|
| The value listed as Thermal Conductivity, ASTM C177 was tested in accordance with ASTM E1461. |
| Note Message | |
|---|---|
| 1 . | 50 mm/min |
| 2 . | 50 mm/min |
| 3 . | 50 mm/min |
| 4 . | 1.3 mm/min |
| 5 . | 1.3 mm/min |
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