| Category: | Epoxy , Epoxy; Epoxide |
| Manufacturer: | Sumitomo Bakelite Co., Ltd. |
| Trademark: | Sumikon® |
| Fillers: | - |
| Ports: | Qinzhou, Shekou, Shanghai, Ningbo |
| Delivery Terms | FOB, CIF, DAP, DAT, DDP |
| PDF: | GH8Y5X_Sumikon-EME-S710A.pdf |
| PRICE: | Order Products email sales@su-jiao.com |
| Message |
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| EME-S710A is a low alpha particle epoxy molding compound. |
| General Information | |
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| Features |
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| Uses |
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| Forms |
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| Processing Method |
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| Physical | Nominal Value | Unit | Test Method |
|---|---|---|---|
| Specific Gravity | 1.89 | g/cm³ | ASTM D792 |
| Water Absorption (24 hr) | 0.40 | % | ASTM D570 |
| Mechanical | Nominal Value | Unit | Test Method |
|---|---|---|---|
| Flexural Modulus (25°C) | 11300 | MPa | ASTM D790 |
| Flexural Strength (25°C) | 93.2 | MPa | ASTM D790 |
| Thermal | Nominal Value | Unit | Test Method |
|---|---|---|---|
| Glass Transition Temperature | 190 | °C | ASTM E1356 |
| Thermal Conductivity | 0.75 | W/m/K | ASTM C177 |
| Electrical | Nominal Value | Unit | Test Method |
|---|---|---|---|
| Volume Resistivity | 1.0E+13 | ohms·cm | ASTM D257 |
| Thermoset | Nominal Value | Unit | |
|---|---|---|---|
| Demold Time (175°C) | 1.5 - 2.0 | min | |
| Post Cure Time (175°C) | 2.0 - 8.0 | hr |
| Additional Information |
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| Spiral Flow, SB-U-03-003: 75 cmGel Time, SB-U-03-005, 175°C: 32 secThermal Expansion, SB-U-02-002, T |
| Resin Grade | Manufacturer | Category | Trademark |
|---|---|---|---|
| RTP 1475 N | RTP Company | PESU | RTP |
| Flontech® FT-GL20-GR5-1 | Guarniflon S.p.A. - Flontech Division | PTFE | Flontech® |
| Hylex® P1310G10FRMA | Ravago Manufacturing Americas, LLC | PC | Hylex® |
| Perfactory® HTM140IV | EnvisionTEC, Inc. | Acrylic, Unspecified | Perfactory® |
| Clearflex® H&T RBH 58 Y | Versalis S.p.A. | HDPE | Clearflex® H&T |