| Category: | HDPE , High Density Polyethylene |
| Manufacturer: | Fainplast Compounds S.r.l |
| Trademark: | Ethylplus |
| Fillers: | - |
| Ports: | Qinzhou, Shekou, Shanghai, Ningbo |
| Delivery Terms | FOB, CIF, DAP, DAT, DDP |
| PDF: | Fl5AaG_Ethylplus-621-HD.pdf |
| PRICE: | Order Products email sales@su-jiao.com |
| Message |
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| Ethylplus is a range of polyethelene and halogen free compounds specially designed for those applications requiring superior thermo-mechanical properties, outstanding heat resistance and high electrical properties. |
| General Information | |
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| Features |
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| Uses |
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| Processing Method |
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| Physical | Nominal Value | Unit | Test Method |
|---|---|---|---|
| Density | 0.949 | g/cm³ | ISO 1183 |
| Melt Mass-Flow Rate (MFR) (190°C/2.16 kg) | 0.90 | g/10 min | ISO 1133 |
| Hardness | Nominal Value | Unit | Test Method |
|---|---|---|---|
| Shore Hardness (Shore D, 15 sec) | 57 | ISO 868 |
| Mechanical | Nominal Value | Unit | Test Method |
|---|---|---|---|
| Tensile Stress (Break) | > 18.0 | MPa | ISO 527-2/50 |
| Tensile Strain (Break) | > 400 | % | ISO 527-2/50 |
| Electrical | Nominal Value | Unit | Test Method |
|---|---|---|---|
| Volume Resistivity (20°C) | > 1.0E+16 | ohms·cm | ASTM D257 |
| Resin Grade | Manufacturer | Category | Trademark |
|---|---|---|---|
| Veroplas ASG30 | PlastxWorld Inc. | SAN | Veroplas |
| UNISOFT ADHESION™ AD-55A-NT-1-01 | UNITED SOFT PLASTICS, Inc. | SEBS | UNISOFT ADHESION™ |
| ACCUTECH™ HP0334G15M15CL | ACLO Compounders Inc. | PP Homopolymer | ACCUTECH™ |
| FORMEX® 94BK | ITW FORMEX | PP, Unspecified | FORMEX® |
| Edgetek™ CY4000-30GF/000 FR V0 GR703 | PolyOne Corporation | PC+PBT | Edgetek™ |