EPO-TEK® H74-110

Category: Epoxy , Epoxy; Epoxide
Manufacturer: Epoxy Technology Inc.
Trademark: EPO-TEK®
Fillers: -
Ports: Qinzhou, Shekou, Shanghai, Ningbo
Delivery Terms FOB, CIF, DAP, DAT, DDP
PDF: FWFzvG_EPO-TEK-H74-110.pdf
PRICE: ​Order Products​ email   sales@su-jiao.com
Wechat: WECHAT
Message
A two component, electrically and thermally insulating epoxy adhesive designed for semiconductor, electronics, medical, and optical applications. It is an IR transparent version of EPO-TEK H74 which enables fiber optic and photonic packaging. Due to its low viscosity, it is useful for sealing, potting and encapsulation projects.
General Information
Features
  • Electrically Insulating
  • Low Viscosity
  • Thermally Insulating
Uses
  • Adhesives
  • Electrical/Electronic Applications
  • Medical/Healthcare Applications
  • Optical Applications
  • Seals
Agency Ratings
  • EC 1907/2006 (REACH)
  • EU 2003/11/EC
  • EU 2006/122/EC
RoHS Compliance
  • RoHS Compliant
Forms
  • Liquid
Processing Method
  • Encapsulating
  • Potting
PhysicalNominal ValueUnit
Ion Type
    Cl- 329ppm
    K+ 5ppm
    NH4+ 409ppm
Additional InformationNominal ValueUnit
Degradation Temperature 494°C
Die Shear Strength - >15 kg (23°C) 35.2MPa
Operating Temperature
    Continuous -55 to 250°C
    Intermittent -55 to 350°C
Storage Modulus 3.86GPa
Weight Loss on Heating
    200°C 0.050%
    250°C 0.030%
    300°C 0.070%
ThermalNominal ValueUnit
Glass Transition Temperature 1> 90.0°C
CLTE - Flow
    -- 24.2E-5cm/cm/°C
    -- 31.8E-4cm/cm/°C
OpticalNominal ValueUnit
Refractive Index 41.569
Transmittance
    550 nm > 50.0%
    700 to 1000 nm > 98.0%
    1100 to 1600 nm > 95.0%
ThermosetNominal ValueUnit
Thermoset Components
    Part A Mix Ratio by Weight: 10
    Part B Mix Ratio by Weight: 1.0
Shelf Life (23°C)52wk
Uncured PropertiesNominal ValueUnit
Color
    -- 5Amber
    -- 6Clear/Transparent
Density
    Part B 1.02g/cm³
    Part A 1.20g/cm³
Viscosity 7(23°C)3.0 to 5.0Pa·s
Curing Time (150°C)1.0hr
Pot Life 120min
Cured PropertiesNominal ValueUnit
Shore Hardness (Shore D)85
Lap Shear Strength (23°C)> 13.8MPa
Relative Permittivity (1 kHz)3.17
Volume Resistivity (23°C)> 2.0E+13ohms·cm
Dissipation Factor (1 kHz)5.0E-3
Note Message
1 .Dynamic Cure 20-200°C/ISO 25 Min; Ramp -10-200°C @ 20°C/Min
2 .Below Tg
3 .Above Tg
4 .589 nm
5 .Part B
6 .Part A
7 .50 rpm
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