EPO-TEK® H77

Category: Epoxy , Epoxy; Epoxide
Manufacturer: Epoxy Technology Inc.
Trademark: EPO-TEK®
Fillers: -
Ports: Qinzhou, Shekou, Shanghai, Ningbo
Delivery Terms FOB, CIF, DAP, DAT, DDP
PDF: E9P89n_EPO-TEK-H77.pdf
PRICE: ​Order Products​ email   sales@su-jiao.com
Wechat: WECHAT
Message
EPO-TEK® H77 is a two component, thermally conductive, electrically insulating epoxy system designed for lid-sealing of hybrids found in hermetic packaging of micro-electronics. Lids can be ceramic, glass, aluminum or kovar. Package types can be plastic, metal cases or ceramic.
General Information
Features
  • Electrically Insulating
  • Good Chemical Resistance
  • Low to No Outgassing
  • Low Viscosity
  • Solvent Resistant
  • Thermally Conductive
Uses
  • Aircraft Applications
  • Automotive Under the Hood
  • Electrical/Electronic Applications
  • Medical/Healthcare Applications
  • Seals
Agency Ratings
  • ASTM E 595
  • EC 1907/2006 (REACH)
  • EU 2003/11/EC
  • EU 2006/122/EC
RoHS Compliance
  • RoHS Compliant
Forms
  • Paste
Processing Method
  • Casting
  • Potting
PhysicalNominal ValueUnit
Particle Size < 50.0µm
Additional InformationNominal ValueUnitTest Method
Degradation Temperature 405°CTGA
Die Shear Strength - >5 kg (23°C) 11.7MPa
Operating Temperature
    Continuous -55 to 250°C
    Intermittent -55 to 350°C
Storage Modulus (23°C) 6.55GPa
Thixotropic Index 1.40
Weight Loss on Heating
    200°C 0.15%
    250°C 0.38%
    300°C 1.5%
ThermalNominal ValueUnit
Glass Transition Temperature 1> 80.0°C
CLTE - Flow
    -- 23.3E-5cm/cm/°C
    -- 31.3E-4cm/cm/°C
Thermal Conductivity 0.66W/m/K
ThermosetNominal ValueUnitTest Method
Thermoset Components
    Part A Mix Ratio by Weight: 100
    Part B Mix Ratio by Weight: 15
Shelf Life (23°C)52wk
Uncured PropertiesNominal ValueUnitTest Method
Color
    -- 4Amber
    -- 5Grey
Density
    Part B 1.22g/cm³
    Part A 2.69g/cm³
Viscosity 6(23°C)6.0 to 12Pa·s
Curing Time (150°C)1.0hr
Pot Life 360min
Cured PropertiesNominal ValueUnitTest Method
Shore Hardness (Shore D)90
Lap Shear Strength (23°C)10.5MPa
Relative Permittivity (1 kHz)5.64
Volume Resistivity (23°C)> 1.0E+13ohms·cm
Dissipation Factor (1 kHz)6.0E-3
Note Message
1 .Dynamic Cure 20-200°C/ISO 25 Min; Ramp -10-200°C @ 20°C/Min
2 .Below Tg
3 .Above Tg
4 .Part B
5 .Part A
6 .20 rpm
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