Celanex® 6035GB20

Category: PBT , Polybutylene Terephthalate
Manufacturer: Celanese Corporation
Trademark: Celanex®
Fillers: -
Ports: Qinzhou, Shekou, Shanghai, Ningbo
Delivery Terms FOB, CIF, DAP, DAT, DDP
PDF: Di0Sgd_Celanex6035GB20.pdf
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20% glass bead filled PBT.
General Information
Filler / Reinforcement
  • Glass beads, 20% filler by weight
RoHS Compliance
  • Contact manufacturer
Processing Method
  • Injection molding
PhysicalNominal ValueUnitTest Method
Density 1.46g/cm³ISO 1183
Molding Shrinkage ISO 294-4
    Transverse flow 1.5%ISO 294-4
    Flow 1.5%ISO 294-4
Water Absorption (Equilibrium, 23°C, 50% RH)0.19%ISO 62
MechanicalNominal ValueUnitTest Method
Tensile Modulus 3300MPaISO 527-2/1A/1
Tensile Stress (Break)46.0MPaISO 527-2/1A/5
Tensile Strain (Break)8.5%ISO 527-2/1A/5
Flexural Modulus (23°C)3300MPaISO 178
Flexural Stress (23°C)80.0MPaISO 178
ImpactNominal ValueUnitTest Method
Charpy Notched Impact Strength ISO 179/1eA
    -30°C 2.8kJ/m²ISO 179/1eA
    23°C 1.7kJ/m²ISO 179/1eA
Charpy Unnotched Impact Strength ISO 179/1eU
    -30°C 19kJ/m²ISO 179/1eU
    23°C 22kJ/m²ISO 179/1eU
Notched Izod Impact (23°C)3.5kJ/m²ISO 180/1A
Unnotched Izod Impact Strength (23°C)15kJ/m²ISO 180/1U
ThermalNominal ValueUnitTest Method
Heat Deflection Temperature
    0.45 MPa, not annealed 168°CISO 75-2/B
    1.8 MPa, not annealed 72.0°CISO 75-2/A
Glass Transition Temperature 50.0°CISO 11357-2
Melting Temperature 1225°CISO 11357-3
Linear thermal expansion coefficient ISO 11359-2
    Flow 7.7E-5cm/cm/°CISO 11359-2
    Lateral 7.7E-5cm/cm/°CISO 11359-2
ElectricalNominal ValueUnitTest Method
Surface Resistivity 1.0E+17ohmsIEC 60093
Volume Resistivity 3.0E+16ohms·cmIEC 60093
Dielectric Strength 30kV/mmIEC 60243-1
Relative Permittivity IEC 60250
    100 Hz 3.70IEC 60250
    1 MHz 3.50IEC 60250
Dissipation Factor (1 MHz)0.017IEC 60250
Comparative Tracking Index 275VIEC 60112
InjectionNominal ValueUnit
Suggested Max Regrind 25%
Hopper Temperature 20 - 50°C
Rear Temperature 230 - 240°C
Middle Temperature 235 - 250°C
Front Temperature 235 - 250°C
Nozzle Temperature 250 - 260°C
Processing (Melt) Temp 235 - 260°C
Mold Temperature 65 - 93°C
Injection Rate Fast
Back Pressure 0.00 - 0.345MPa
Injection instructions
Manifold Temperature: 250 to 260°CZone 4 Temperature: 240 to 260°CFeed Temperature: 230 to 240°C
Note Message
1 .10°C/min
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