EPO-TEK® H20E

Category: Epoxy , Epoxy; Epoxide
Manufacturer: Epoxy Technology Inc.
Trademark: EPO-TEK®
Fillers: -
Ports: Qinzhou, Shekou, Shanghai, Ningbo
Delivery Terms FOB, CIF, DAP, DAT, DDP
PDF: DOtoDd_EPO-TEK-H20E.pdf
PRICE: ​Order Products​ email   sales@su-jiao.com
Wechat: WECHAT
Message
EPO-TEK® H20E is a two component, 100% solids silver-filled epoxy system designed specifically for chip bonding in microelectronic and optoelectronic applications. It is also used extensively for thermal management applications due to its high thermal conductivity. It has proven itself to be extremely reliable over many years of service and is still the conductive adhesive of choice for new applications. Also available in a single component frozen syringe.
General Information
Filler / Reinforcement
  • Silver
Features
  • Biocompatible
  • Electrically Conductive
  • Electromagnetic Shielding (EMI)
  • Low to No Outgassing
  • Radio Frequency Shielding (RFI)
  • Thermally Conductive
  • Thixotropic
Uses
  • Adhesives
  • Automotive Applications
  • Bonding
  • Electrical/Electronic Applications
  • Medical/Healthcare Applications
  • Printed Circuit Boards
Agency Ratings
  • EC 1907/2006 (REACH)
  • EU 2003/11/EC
  • EU 2006/122/EC
  • USP Class VI
RoHS Compliance
  • RoHS Compliant
Forms
  • Paste
PhysicalNominal ValueUnit
Ion Type
    Cl- 73ppm
    K+ 3ppm
    Na+ 2ppm
    NH4+ 98ppm
Particle Size < 45.0µm
Additional InformationNominal ValueUnitTest Method
Degradation Temperature 425°CTGA
Die Shear Strength - >10 kg (23°C) 23.4MPa
Operating Temperature
    Continuous -55 to 200°C
    Intermittent -55 to 300°C
Storage Modulus (23°C) 5.58GPa
Thixotropic Index 4.63
Weight Loss on Heating
    200°C 0.59%
    250°C 1.1%
    300°C 1.7%
ThermalNominal ValueUnit
Glass Transition Temperature 1> 80.0°C
CLTE - Flow
    -- 23.1E-5cm/cm/°C
    -- 31.6E-4cm/cm/°C
Thermal Conductivity
    -- 42.5W/m/K
    -- 529W/m/K
ThermosetNominal ValueUnitTest Method
Thermoset Components
    Part A Mix Ratio by Weight: 1.0
    Part B Mix Ratio by Weight: 1.0
Shelf Life (23°C)52wk
Uncured PropertiesNominal ValueUnitTest Method
Color
    -- 6Silver
    -- 7Silver
Density
    Part A 2.02g/cm³
    Part B 3.06g/cm³
Viscosity 8(23°C)2.2 to 3.2Pa·s
Curing Time (150°C)1.0hr
Pot Life 3600min
Cured PropertiesNominal ValueUnitTest Method
Shore Hardness (Shore D)75
Lap Shear Strength (23°C)10.2MPa
Volume Resistivity (23°C)< 4.0E-4ohms·cm
Note Message
1 .Dynamic Cure 20-200°C/ISO 25 Min; Ramp -10-200°C @ 20°C/Min
2 .Below Tg
3 .Above Tg
4 .Based on standard method: Laser Flash
5 .Based on Thermal Resistance Data: R = L x K^-1 x A^-1
6 .Part B
7 .Part A
8 .100 rpm
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