Category: | PI, TS , Thermoset Polyimide |
Manufacturer: | Epoxy Technology Inc. |
Trademark: | EPO-TEK® |
Fillers: | - |
Ports: | Qinzhou, Shekou, Shanghai, Ningbo |
Delivery Terms | FOB, CIF, DAP, DAT, DDP |
PDF: | CvgyUy_EPO-TEK-TV1003.pdf ![]() |
PRICE: | Order Products email sales@su-jiao.com |
Message |
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A single component, screen printable polyimide adhesive designed for semiconductor wafer passivation applications. It is a high temperature chemistry capable of resisting >400°C seen in back-end wafer fabrication processes. Coating thicknesses of 10-90 um may be achieved. Ultra fine print definition, high Tg, low outgassing, and ionic cleanliness are a few of its traits. It is an increased dielectric strength of EPO-TEK® TV1002. Formerly 78-119 |
General Information | |
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Features |
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Uses |
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Agency Ratings |
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RoHS Compliance |
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Physical | Nominal Value | Unit | |
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Ion Type | |||
Cl- | 3 | ppm | |
K+ | 1 | ppm | |
Na+ | 15 | ppm | |
NH4+ | 96 | ppm | |
Particle Size | < 10.0 | µm |
Additional Information | Nominal Value | Unit | |
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Degradation Temperature | 541 | °C | |
Drying Time | 672.0 | hr | |
Operating Temperature | |||
Continuous | -55 to 300 | °C | |
Intermittent | -55 to 400 | °C | |
Storage Modulus (23°C) | 1.96 | GPa | |
Thixotropic Index | 1.40 | ||
Weight Loss on Heating | |||
200°C | < 0.050 | % | |
250°C | < 0.050 | % | |
300°C | < 0.050 | % |
Thermal | Nominal Value | Unit | |
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Glass Transition Temperature 1 | > 200 | °C | |
CLTE - Flow | |||
-- 2 | 2.8E-5 | cm/cm/°C | |
-- 3 | 3.6E-5 | cm/cm/°C | |
Thermal Conductivity | 0.77 | W/m/K |
Thermoset | Nominal Value | Unit | |
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Shelf Life (23°C) | 52 | wk |
Uncured Properties | Nominal Value | Unit | |
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Color | Ivory | ||
Density | 1.24 | g/cm³ | |
Viscosity 4(23°C) | 330 to 530 | Pa·s | |
Curing Time 5 | 2.0 | hr |
Cured Properties | Nominal Value | Unit | |
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Shore Hardness (Shore D) | 60 |
Note Message | |
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1 . | Cure 150°C/1 hour + 275°C/1 hours; Ramp 20°C/min to 350°C |
2 . | Below Tg |
3 . | Above Tg |
4 . | 0.5 rpm |
5 . | 150°C/1 Hour + 275°C/1 Hour |
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