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EPO-TEK® H62
| Category: | Epoxy , Epoxy; Epoxide |
| Manufacturer: | Epoxy Technology Inc. |
| Trademark: | EPO-TEK® |
| Fillers: | - |
| Ports: | Qinzhou, Shekou, Shanghai, Ningbo |
| Delivery Terms | FOB, CIF, DAP, DAT, DDP |
| PDF: | Coo6cz_EPO-TEK-H62.pdf  |
| PRICE: | Order Products email sales@su-jiao.com |
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| Message |
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| EPO-TEK® H62 is a single component, electrically insulating, and thermally conductive epoxy adhesive. It may be used for heat-sinking semiconductor, hybrids, or electronic circuits. |
| General Information | |
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| Features |
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| Uses |
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| Agency Ratings |
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| RoHS Compliance |
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| Forms |
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| Physical | Nominal Value | Unit | |
|---|---|---|---|
| Ion Type | |||
| Cl- | 55 | ppm | |
| K+ | 28 | ppm | |
| Na+ | 136 | ppm | |
| NH4+ | 96 | ppm | |
| Particle Size | < 50.0 | µm |
| Additional Information | Nominal Value | Unit | Test Method |
|---|---|---|---|
| Degradation Temperature | 436 | °C | TGA |
| Die Shear Strength - >15 kg (23°C) | 35.2 | MPa | |
| Operating Temperature | |||
| Continuous | -55 to 275 | °C | |
| Intermittent | -55 to 375 | °C | |
| Storage Modulus (23°C) | 4.53 | GPa | |
| Thixotropic Index | 1.89 | ||
| Weight Loss on Heating | |||
| 200°C | 0.31 | % | |
| 250°C | 0.42 | % | |
| 300°C | 0.62 | % |
| Thermal | Nominal Value | Unit | |
|---|---|---|---|
| Glass Transition Temperature 1 | > 110 | °C | |
| CLTE - Flow | |||
| -- 2 | 4.8E-5 | cm/cm/°C | |
| -- 3 | 1.2E-4 | cm/cm/°C | |
| Thermal Conductivity | 0.50 | W/m/K |
| Optical | Nominal Value | Unit | |
|---|---|---|---|
| Transmittance (300 to 2500 nm) | < 1.0 | % |
| Thermoset | Nominal Value | Unit | Test Method |
|---|---|---|---|
| Shelf Life 4 | 52 | wk |
| Uncured Properties | Nominal Value | Unit | Test Method |
|---|---|---|---|
| Color | Black Opaque | ||
| Density | 1.78 | g/cm³ | |
| Viscosity 5(23°C) | 17 to 27 | Pa·s | |
| Curing Time (150°C) | 1.0 | hr | |
| Pot Life | 22000 | min |
| Cured Properties | Nominal Value | Unit | Test Method |
|---|---|---|---|
| Shore Hardness (Shore D) | 80 | ||
| Lap Shear Strength (23°C) | 4.14 | MPa | |
| Relative Permittivity (1 kHz) | 4.65 | ||
| Volume Resistivity (23°C) | > 2.0E+13 | ohms·cm | |
| Dissipation Factor (1 kHz) | 0.011 |
| Note Message | |
|---|---|
| 1 . | Dynamic Cure 20-200°C/ISO 25 Min; Ramp -10-200°C @ 20°C/Min |
| 2 . | Below Tg |
| 3 . | Above Tg |
| 4 . | Refrigerated |
| 5 . | 10 rpm |
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