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Devcon Floor Patch™

Category:	Epoxy , Epoxy; Epoxide
Manufacturer:	Devcon
Trademark:	Devcon
Fillers:	-
Ports:	Qinzhou, Shekou, Shanghai, Ningbo
Delivery Terms	FOB, CIF, DAP, DAT, DDP
PDF:	CBkfVo_Devcon-Floor-Patch-.pdf
PRICE:	Order Products email sales@su-jiao.com

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All-purpose concrete patching compound that bonds to concrete, brick, masonry, metal, or wood surfaces.

Intended Use:

Ideal for patching concrete, brick, masonry, floors, or retaining walls where the concrete has spalled. The material will also bond to wood and metal. Can be used to anchor bolts in concrete.

Product Features:

Easy to mix and apply

Trowelable to 1/4" or more

High compressive strength

Resistant to water, oils, solvents, and alkalis

General Information
Features	Solvent resistance Adhesiveness Good compressive strength alkali resistance Oil resistance
Uses	Floor maintenance/repair Repair Materials
Appearance	Light gray

Physical	Nominal Value	Unit	Test Method
Solid content- by Volume	100	%

Additional Information	Nominal Value	Unit
Temperature Resistance
Dry	121	°C
Wet	49	°C

Hardness	Nominal Value	Unit	Test Method
Durometer Hardness (Shore D)	85		ASTM D2240

Mechanical	Nominal Value	Unit	Test Method
Compressive Strength	55.2	MPa	ASTM D695

Thermoset	Nominal Value	Unit
Thermoset Components
Resin	Mixing ratio by weight: 5.5
Hardening method	Mixing ratio by weight: 1.0
Pot Life (24°C)	45	min

Additional Information	Nominal Value	Unit
Cured 7 days @ 75°F

Uncured Properties	Nominal Value	Unit
Curing Time (24°C)	16	hr

Resin Grade	Manufacturer	Category	Trademark
Maxxam™ FR PE CONC 1 NAT	PolyOne Corporation	LDPE	Maxxam™ FR
Sanren F200A (1st-grade)	SINOPEC Shanghai Petrochemical Co. Ltd.	PP Homopolymer	Sanren
Telcar® DE 6052	Teknor Apex Asia Pacific PTE. LTD.	TPE	Telcar®
Kepamid® 2300ST	Korea Engineering Plastics Co., Ltd	Nylon 66	Kepamid®
POLYfill PPH T15040	Polykemi AB	PP Homopolymer	POLYfill