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EPO-TEK® H70E-4
| Category: | Epoxy , Epoxy; Epoxide |
| Manufacturer: | Epoxy Technology Inc. |
| Trademark: | EPO-TEK® |
| Fillers: | - |
| Ports: | Qinzhou, Shekou, Shanghai, Ningbo |
| Delivery Terms | FOB, CIF, DAP, DAT, DDP |
| PDF: | C4h2Eg_EPO-TEK-H70E-4.pdf  |
| PRICE: | Order Products email sales@su-jiao.com |
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| Message |
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| EPO-TEK® H70E-4 is a two component, thermally conductive, electrically insulating epoxy adhesive for semiconductor, micro-electronic and opto-electronic packaging. It may be used for heat sinking power devices in the form of hybrid circuits or at the SMD / PCB level. |
| General Information | |
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| Features |
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| Uses |
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| Agency Ratings |
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| RoHS Compliance |
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| Forms |
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| Physical | Nominal Value | Unit | |
|---|---|---|---|
| Particle Size | < 20.0 | µm |
| Additional Information | Nominal Value | Unit | Test Method |
|---|---|---|---|
| Degradation Temperature | 432 | °C | TGA |
| Die Shear Strength - >5 kg (23°C) | 11.7 | MPa | |
| Operating Temperature | |||
| Continuous | -55 to 200 | °C | |
| Intermittent | -55 to 300 | °C | |
| Storage Modulus (23°C) | 2.87 | GPa | |
| Thixotropic Index | 3.20 | ||
| Weight Loss on Heating | |||
| 200°C | 0.57 | % | |
| 250°C | 1.5 | % | |
| 300°C | 3.1 | % |
| Thermal | Nominal Value | Unit | |
|---|---|---|---|
| Glass Transition Temperature 1 | > 80.0 | °C | |
| CLTE - Flow | |||
| -- 2 | 1.7E-5 | cm/cm/°C | |
| -- 3 | 7.7E-5 | cm/cm/°C | |
| Thermal Conductivity | 0.57 | W/m/K |
| Thermoset | Nominal Value | Unit | Test Method |
|---|---|---|---|
| Thermoset Components | |||
| Part A | Mix Ratio by Weight: 1.0 | ||
| Part B | Mix Ratio by Weight: 1.0 | ||
| Shelf Life (23°C) | 52 | wk |
| Uncured Properties | Nominal Value | Unit | Test Method |
|---|---|---|---|
| Color | |||
| -- 4 | Grey | ||
| -- 5 | Grey | ||
| Density | |||
| Part A | 1.61 | g/cm³ | |
| Part B | 2.01 | g/cm³ | |
| Viscosity 6(23°C) | 20 to 40 | Pa·s | |
| Curing Time (150°C) | 1.0 | hr | |
| Pot Life | 3600 | min |
| Cured Properties | Nominal Value | Unit | Test Method |
|---|---|---|---|
| Shore Hardness (Shore D) | 67 | ||
| Lap Shear Strength (23°C) | 7.38 | MPa | |
| Relative Permittivity (1 kHz) | 4.81 | ||
| Volume Resistivity (23°C) | > 2.5E+13 | ohms·cm | |
| Dissipation Factor (1 kHz) | 0.018 |
| Note Message | |
|---|---|
| 1 . | Dynamic Cure 20-200°C/ISO 25 Min; Ramp -40-200°C @ 20°C/Min |
| 2 . | Below Tg |
| 3 . | Above Tg |
| 4 . | Part B |
| 5 . | Part A |
| 6 . | 10 rpm |
| Resin Grade | Manufacturer | Category | Trademark |
|---|---|---|---|
| Shin-Etsu Elastomer SF-11500U | Shin-Etsu Silicones of America | Fluoro Si | Shin-Etsu Elastomer |
| Borealis LE6025 | Borealis AG | LDPE | Borealis |
| Ethylplus 619 LD | Fainplast Compounds S.r.l | LDPE | Ethylplus |
| KOPLA PET KEG1030 | KOPLA Co., Ltd. | PET | KOPLA PET |
| O'Tech OW 645 | O'Tech Corporation | PVC, Unspecified | O'Tech |
