EPO-TEK® H70E-4

Category: Epoxy , Epoxy; Epoxide
Manufacturer: Epoxy Technology Inc.
Trademark: EPO-TEK®
Fillers: -
Ports: Qinzhou, Shekou, Shanghai, Ningbo
Delivery Terms FOB, CIF, DAP, DAT, DDP
PDF: C4h2Eg_EPO-TEK-H70E-4.pdf
PRICE: ​Order Products​ email   sales@su-jiao.com
Wechat: WECHAT
Message
EPO-TEK® H70E-4 is a two component, thermally conductive, electrically insulating epoxy adhesive for semiconductor, micro-electronic and opto-electronic packaging. It may be used for heat sinking power devices in the form of hybrid circuits or at the SMD / PCB level.
General Information
Features
  • Electrically Insulating
  • Good Adhesion
  • Thermally Conductive
  • Thixotropic
Uses
  • Adhesives
  • Bonding
  • Electrical/Electronic Applications
  • Printed Circuit Boards
Agency Ratings
  • EC 1907/2006 (REACH)
  • EU 2003/11/EC
  • EU 2006/122/EC
RoHS Compliance
  • RoHS Compliant
Forms
  • Paste
PhysicalNominal ValueUnit
Particle Size < 20.0µm
Additional InformationNominal ValueUnitTest Method
Degradation Temperature 432°CTGA
Die Shear Strength - >5 kg (23°C) 11.7MPa
Operating Temperature
    Continuous -55 to 200°C
    Intermittent -55 to 300°C
Storage Modulus (23°C) 2.87GPa
Thixotropic Index 3.20
Weight Loss on Heating
    200°C 0.57%
    250°C 1.5%
    300°C 3.1%
ThermalNominal ValueUnit
Glass Transition Temperature 1> 80.0°C
CLTE - Flow
    -- 21.7E-5cm/cm/°C
    -- 37.7E-5cm/cm/°C
Thermal Conductivity 0.57W/m/K
ThermosetNominal ValueUnitTest Method
Thermoset Components
    Part A Mix Ratio by Weight: 1.0
    Part B Mix Ratio by Weight: 1.0
Shelf Life (23°C)52wk
Uncured PropertiesNominal ValueUnitTest Method
Color
    -- 4Grey
    -- 5Grey
Density
    Part A 1.61g/cm³
    Part B 2.01g/cm³
Viscosity 6(23°C)20 to 40Pa·s
Curing Time (150°C)1.0hr
Pot Life 3600min
Cured PropertiesNominal ValueUnitTest Method
Shore Hardness (Shore D)67
Lap Shear Strength (23°C)7.38MPa
Relative Permittivity (1 kHz)4.81
Volume Resistivity (23°C)> 2.5E+13ohms·cm
Dissipation Factor (1 kHz)0.018
Note Message
1 .Dynamic Cure 20-200°C/ISO 25 Min; Ramp -40-200°C @ 20°C/Min
2 .Below Tg
3 .Above Tg
4 .Part B
5 .Part A
6 .10 rpm
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