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EPO-TEK® H81A
| Category: | Epoxy , Epoxy; Epoxide |
| Manufacturer: | Epoxy Technology Inc. |
| Trademark: | EPO-TEK® |
| Fillers: | - |
| Ports: | Qinzhou, Shekou, Shanghai, Ningbo |
| Delivery Terms | FOB, CIF, DAP, DAT, DDP |
| PDF: | C3n5Ch_EPO-TEK-H81A.pdf  |
| PRICE: | Order Products email sales@su-jiao.com |
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| A two component, gold-filled, electrically and thermally conductive epoxy designed for hybrid microelectronic and semiconductor packaging. |
| General Information | |
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| Filler / Reinforcement |
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| Features |
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| Uses |
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| Agency Ratings |
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| RoHS Compliance |
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| Forms |
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| Physical | Nominal Value | Unit | |
|---|---|---|---|
| Particle Size | < 50.0 | µm |
| Additional Information | Nominal Value | Unit | |
|---|---|---|---|
| Degradation Temperature | 412 | °C | |
| Die Shear Strength - >5 kg (23°C) | > 11.7 | MPa | |
| Operating Temperature | |||
| Continuous | -55 to 250 | °C | |
| Intermittent | -55 to 350 | °C | |
| Weight Loss on Heating | |||
| 200°C | < 0.050 | % | |
| 250°C | 0.070 | % | |
| 300°C | 0.16 | % |
| Thermal | Nominal Value | Unit | |
|---|---|---|---|
| Glass Transition Temperature 1 | > 100 | °C |
| Thermoset | Nominal Value | Unit | |
|---|---|---|---|
| Thermoset Components | |||
| Part A | Mix Ratio by Weight: 6.0 | ||
| Part B | Mix Ratio by Weight: 1.0 | ||
| Shelf Life (23°C) | 52 | wk |
| Uncured Properties | Nominal Value | Unit | |
|---|---|---|---|
| Color | |||
| -- 2 | Brown | ||
| -- 3 | Brown | ||
| Density | |||
| Part B | 5.61 | g/cm³ | |
| Part A | 5.79 | g/cm³ | |
| Viscosity 4(23°C) | 250 to 300 | Pa·s | |
| Curing Time (150°C) | 1.0 | hr | |
| Pot Life | 2900 | min |
| Cured Properties | Nominal Value | Unit | |
|---|---|---|---|
| Volume Resistivity (23°C) | < 9.0E-4 | ohms·cm |
| Note Message | |
|---|---|
| 1 . | Dynamic Cure 20-200°C/ISO 25 Min; Ramp -10-200°C @ 20°C/Min |
| 2 . | Part B |
| 3 . | Part A |
| 4 . | 0.5 rpm |
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