EPO-TEK® E4110-PFC

Category: Epoxy , Epoxy; Epoxide
Manufacturer: Epoxy Technology Inc.
Trademark: EPO-TEK®
Fillers: -
Ports: Qinzhou, Shekou, Shanghai, Ningbo
Delivery Terms FOB, CIF, DAP, DAT, DDP
PDF: BpkWWa_EPO-TEK-E4110-PFC.pdf
PRICE: ​Order Products​ email   sales@su-jiao.com
Wechat: WECHAT
Message
EPO-TEK® E4110-PFC is a two-component, silver filled, electrically conductive adhesive designed for semiconductor IC packaging and general electronic assembly. It is a thixotropic version of EPO-TEK® E4110, suggested for applications requiring a screen printing process as well as jetting.
General Information
Filler / Reinforcement
  • Silver
Features
  • Electrically Conductive
  • Thixotropic
Uses
  • Adhesives
  • Electrical/Electronic Applications
  • LCD Applications
  • Medical/Healthcare Applications
  • Printed Circuit Boards
Agency Ratings
  • EC 1907/2006 (REACH)
  • EU 2003/11/EC
  • EU 2006/122/EC
RoHS Compliance
  • RoHS Compliant
Forms
  • Paste
PhysicalNominal ValueUnit
Ion Type
    Cl- 32ppm
    K+ 2ppm
    Na+ 13ppm
    NH4+ 20ppm
Particle Size < 20.0µm
Additional InformationNominal ValueUnitTest Method
Degradation Temperature 337°CTGA
Die Shear Strength - >5 kg (23°C) 11.7MPa
Operating Temperature
    Continuous -55 to 150°C
    Intermittent -55 to 250°C
Storage Modulus (23°C) 1.53GPa
Thixotropic Index 3.30
Weight Loss on Heating
    200°C 0.37%
    250°C 0.88%
    300°C 1.4%
ThermalNominal ValueUnit
Glass Transition Temperature 1> 40.0°C
CLTE - Flow
    -- 24.8E-5cm/cm/°C
    -- 32.1E-4cm/cm/°C
Thermal Conductivity 1.6W/m/K
ThermosetNominal ValueUnitTest Method
Thermoset Components
    Part A Mix Ratio by Weight: 3.0
    Part B Mix Ratio by Weight: 1.0
Shelf Life (23°C)52wk
Uncured PropertiesNominal ValueUnitTest Method
Color
    -- 4Silver
    -- 5Silver
Density
    Part A 3.25g/cm³
    Part B 3.96g/cm³
Viscosity 6(23°C)50 to 60Pa·s
Curing Time (80°C)3.0hr
Pot Life 120 to 180min
Cured PropertiesNominal ValueUnitTest Method
Shore Hardness (Shore D)68
Lap Shear Strength (23°C)8.62MPa
Volume Resistivity (23°C)< 5.0E-4ohms·cm
Note Message
1 .Dynamic Cure 20-200°C/ISO 25 Min; Ramp -40-200°C @ 20°C/Min
2 .Below Tg
3 .Above Tg
4 .Part B
5 .Part A
6 .5 rpm
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