EPO-TEK® U300-2

Category: Epoxy , Epoxy; Epoxide
Manufacturer: Epoxy Technology Inc.
Trademark: EPO-TEK®
Fillers: -
Ports: Qinzhou, Shekou, Shanghai, Ningbo
Delivery Terms FOB, CIF, DAP, DAT, DDP
PDF: BZcAFB_EPO-TEK-U300-2.pdf
PRICE: ​Order Products​ email   sales@su-jiao.com
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Message
A two component epoxy designed for capillary underfill of semiconductor chips and SMDs. Long pot-life, high Tg, and optical clarity are a few of its traits. NASA approved low outgassing epoxy (http://outgassing.nasa.gov) suitable for electronic applications such as smart cards, RFIDs, medical implants and wafer level camera optics.
General Information
Features
  • Low to No Outgassing
Uses
  • Electrical/Electronic Applications
  • Medical/Healthcare Applications
Agency Ratings
  • EC 1907/2006 (REACH)
  • EU 2003/11/EC
  • EU 2006/122/EC
RoHS Compliance
  • RoHS Compliant
Forms
  • Liquid
PhysicalNominal ValueUnit
Ion Type
    Cl- 100ppm
    K+ 6ppm
    Na+ 14ppm
    NH4+ 274ppm
Additional InformationNominal ValueUnit
Degradation Temperature 425°C
Die Shear Strength - 20 kg (23°C) 46.9MPa
Operating Temperature
    Continuous -55 to 225°C
    Intermittent -55 to 325°C
Storage Modulus 1.85GPa
Weight Loss on Heating
    200°C < 0.050%
    250°C < 0.050%
    300°C 0.15%
ThermalNominal ValueUnit
Glass Transition Temperature 1> 115°C
CLTE - Flow
    -- 25.5E-5cm/cm/°C
    -- 31.8E-4cm/cm/°C
OpticalNominal ValueUnit
Refractive Index 41.575
Transmittance (600 to 2100 nm)> 97.0%
ThermosetNominal ValueUnit
Thermoset Components
    Part A Mix Ratio by Weight: 10
    Part B Mix Ratio by Weight: 1.0
Shelf Life (23°C)52wk
Uncured PropertiesNominal ValueUnit
Color
    -- 5Clear/Transparent
    -- 6Clear/Transparent
Density
    Part B 1.10g/cm³
    Part A 1.20g/cm³
Viscosity 7(23°C)3.7 to 6.7Pa·s
Curing Time (150°C)1.0hr
Pot Life 2900min
Cured PropertiesNominal ValueUnit
Shore Hardness (Shore D)80
Lap Shear Strength (23°C)10.8MPa
Relative Permittivity (1 kHz)3.04
Volume Resistivity (23°C)> 3.0E+13ohms·cm
Dissipation Factor (1 kHz)0.011
Note Message
1 .Dynamic Cure 20-200°C/ISO 25 Min; Ramp -10-200°C @ 20°C/Min
2 .Below Tg
3 .Above Tg
4 .589 nm
5 .Part B
6 .Part A
7 .20 rpm
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