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AURUM® JCN3030
| Category: | PI, TP , Thermoplastic Polyimide |
| Manufacturer: | Mitsui Chemicals, Inc. |
| Trademark: | AURUM® |
| Fillers: | - |
| Ports: | Qinzhou, Shekou, Shanghai, Ningbo |
| Delivery Terms | FOB, CIF, DAP, DAT, DDP |
| PDF: | BD3GaR_AURUMJCN3030.pdf  |
| PRICE: | Order Products email sales@su-jiao.com |
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Features
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| General Information | |
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| Filler / Reinforcement |
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| Features |
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| Forms |
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| Physical | Nominal Value | Unit | Test Method |
|---|---|---|---|
| Specific Gravity | 1.43 | g/cm³ | ASTM D792 |
| Molding Shrinkage | Internal method | ||
| Flow | 0.0 | % | Internal method |
| Transverse flow | 0.66 | % | Internal method |
| Mechanical | Nominal Value | Unit | Test Method |
|---|---|---|---|
| Tensile Strength | 252 | MPa | ASTM D638 |
| Tensile Elongation (Break) | 2.0 | % | ASTM D638 |
| Flexural Modulus | 22500 | MPa | ASTM D790 |
| Flexural Strength | 360 | MPa | ASTM D790 |
| Impact | Nominal Value | Unit | Test Method |
|---|---|---|---|
| Unnotched Izod Impact | 120 | J/m | ASTM D256 |
| Thermal | Nominal Value | Unit | Test Method |
|---|---|---|---|
| Deflection Temperature Under Load (1.8 MPa, Unannealed) | 246 | °C | ASTM D648 |
| Linear thermal expansion coefficient | ASTM D696 | ||
| Flow | 6.0E-6 | cm/cm/°C | ASTM D696 |
| Lateral | 4.7E-5 | cm/cm/°C | ASTM D696 |
| Resin Grade | Manufacturer | Category | Trademark |
|---|---|---|---|
| RTP 800.5 TFE 10 | RTP Company | Acetal (POM) Copolymer | RTP |
| Stratasys PC-ISO | Stratasys | PC | Stratasys |
| TRILOY® 615 | Samyang Corporation | PC Alloy | TRILOY® |
| Plaskon SMT-B-2FP | Cookson Electronics - Semiconductor Products | Epoxy | Plaskon |
| OTECH ALLOY OTE8840 - Calendering | OTECH Corporation | TP, Unspecified | OTECH ALLOY |
