Plaskon LS-16 Datasheet,Epoxy,Cookson Electronics - Semiconductor Products-SHANGHAI SUSHENG

Message
This material is a low stress molding compound specifically formulated for use with automated molding equipment to increase semiconductor manufacturing productivity and reduce production costs. This compound is recommended for molding of stress sensitive DIPs, SOICs, PLCCs and small QFPs.

General Information
Features	Semi-conductive Low viscosity Fast molding cycle Fast curing Good formability
Forms	Liquid
Processing Method	Resin transfer molding

Physical	Nominal Value	Unit	Test Method
Specific Gravity	1.83	g/cm³	ASTM D792

Mechanical	Nominal Value	Unit	Test Method
Flexural Modulus	1.17	MPa	ASTM D790
Flexural Strength	0.0110	MPa	ASTM D790

Thermal	Nominal Value	Unit	Test Method
Glass Transition Temperature	152	°C	ASTM E1356
CLTE - Flow	1.7E-5	cm/cm/°C	ASTM D696

Electrical	Nominal Value	Unit	Test Method
Volume Resistivity	9.5E+15	ohms·cm	ASTM D257
Dielectric Strength	16	kV/mm	ASTM D149
Dielectric Constant (1 kHz)	3.30		ASTM D150
Dissipation Factor (1 kHz)	3.0E-3		ASTM D150
Arc Resistance	180	sec	ASTM D495

Flammability	Nominal Value	Unit	Test Method
Flame Rating (3.18 mm)	V-0		UL 94
Oxygen Index	30	%	ASTM D2863

Additional Information
Recommended Storage Temperature: 5°CLife @ 5°C, defined as not more than 40% loss of spiral flow based on original values.: 24 monthsLife @ 21°C, defined as not more than 40% loss of spiral flow based on original values.: 5 daysLife @ 35°C, defined as not more than 40% loss of spiral flow based on original values.: 2 daysSpiral Flow, 175°C, 1000 psi: 51 cmAutomatic Orifice Viscosity, 165°C, Shear Rate is 68000 sec-1, 1 mm die length, 1/2 mm diameter: 18 Pascal secRam Follower Gel Time, 165°C, 1000 psi: 14 secAsh Content: 74.2 %Hydrolyzable Halides: <1 ppmCull Hot Hardness, Shore D, 75 sec, 165°C: 80Arc Resistance, 110v AC180 secThe following information was transfer molded and post cured for 2 hours at 165°C Glass Transition Temperature Tg: 162°C Linear Thermal Expansion, Alpha 1: 15.9 cm^-6/cm/°C Linear Thermal Expansion, Alpha 2: 66 cm^-6/cm/°C The following information was transfer molded and post cured for 2 hours at 175°C Glass Transition Temperature Tg: 165°C Linear Thermal Expansion, Alpha 1: 15.6 cm^-6/cm/°C Linear Thermal Expansion, Alpha 2: 67 cm^-6/cm/°C Thermal Conductivity15.7 cal/cm-sec-°C The following information was transfer molded and post cured for 4 hours at 165°C Glass Transition Temperature Tg: 150°C Linear Thermal Expansion, Alpha 1: 16.7 cm^-6/cm/°C Linear Thermal Expansion, Alpha 2: 61 cm^-6/cm/°C The following information was transfer molded and post cured for 4 hours at 175°C Glass Transition Temperature Tg: 152°C Linear Thermal Expansion, Alpha 1: 17.4 cm^-6/cm/°C Linear Thermal Expansion, Alpha 2: 64 cm^-6/cm/°C The following information was transfer molded and post cured for 15 minutes at 165°C Glass Transition Temperature Tg: 160°C Linear Thermal Expansion, Alpha 1: 16.5 cm^-6/cm/°C Linear Thermal Expansion, Alpha 2: 65 cm^-6/cm/°C The following information was transfer molded and post cured for 15 minutes at 175°C Glass Transition Temperature Tg: 162°C Linear Thermal Expansion, Alpha 1: 17.4 cm^-6/cm/°C Linear Thermal Expansion, Alpha 2: 67 cm^-6/cm/°C

Additional Information

Recommended Storage Temperature: 5°CLife @ 5°C, defined as not more than 40% loss of spiral flow based on original values.: 24 monthsLife @ 21°C, defined as not more than 40% loss of spiral flow based on original values.: 5 daysLife @ 35°C, defined as not more than 40% loss of spiral flow based on original values.: 2 daysSpiral Flow, 175°C, 1000 psi: 51 cmAutomatic Orifice Viscosity, 165°C, Shear Rate is 68000 sec-1, 1 mm die length, 1/2 mm diameter: 18 Pascal secRam Follower Gel Time, 165°C, 1000 psi: 14 secAsh Content: 74.2 %Hydrolyzable Halides: <1 ppmCull Hot Hardness, Shore D, 75 sec, 165°C: 80Arc Resistance, 110v AC180 secThe following information was transfer molded and post cured for 2 hours at 165°C Glass Transition Temperature Tg: 162°C Linear Thermal Expansion, Alpha 1: 15.9 cm^-6/cm/°C Linear Thermal Expansion, Alpha 2: 66 cm^-6/cm/°C The following information was transfer molded and post cured for 2 hours at 175°C Glass Transition Temperature Tg: 165°C Linear Thermal Expansion, Alpha 1: 15.6 cm^-6/cm/°C Linear Thermal Expansion, Alpha 2: 67 cm^-6/cm/°C Thermal Conductivity15.7 cal/cm-sec-°C The following information was transfer molded and post cured for 4 hours at 165°C Glass Transition Temperature Tg: 150°C Linear Thermal Expansion, Alpha 1: 16.7 cm^-6/cm/°C Linear Thermal Expansion, Alpha 2: 61 cm^-6/cm/°C The following information was transfer molded and post cured for 4 hours at 175°C Glass Transition Temperature Tg: 152°C Linear Thermal Expansion, Alpha 1: 17.4 cm^-6/cm/°C Linear Thermal Expansion, Alpha 2: 64 cm^-6/cm/°C The following information was transfer molded and post cured for 15 minutes at 165°C Glass Transition Temperature Tg: 160°C Linear Thermal Expansion, Alpha 1: 16.5 cm^-6/cm/°C Linear Thermal Expansion, Alpha 2: 65 cm^-6/cm/°C The following information was transfer molded and post cured for 15 minutes at 175°C Glass Transition Temperature Tg: 162°C Linear Thermal Expansion, Alpha 1: 17.4 cm^-6/cm/°C Linear Thermal Expansion, Alpha 2: 67 cm^-6/cm/°C

Injection instructions
Auto Resin TransferMolding: Molding Temperature: 165 to 175°C Molding Pressure: 500 to 1000 psi Cycle Time, 175°C: 30 to 40 sec Cycle Time, 165°C: 40 sec Post Mold Cure Time, 175°C: 0 to 15 hr Post Mold Cure Time, 165°C: 0 to 15 hr

Category:	Epoxy , Epoxy; Epoxide
Manufacturer:	Cookson Electronics - Semiconductor Products
Trademark:	Plaskon
Fillers:	-
Ports:	Qinzhou, Shekou, Shanghai, Ningbo
Delivery Terms	FOB, CIF, DAP, DAT, DDP
PDF:	B91tpz_Plaskon-LS-16.pdf
PRICE:	Order Products email sales@su-jiao.com

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