Vyncolit® E 57425

Category: Epoxy , Epoxy; Epoxide
Manufacturer: Vyncolit N.V.
Trademark: Vyncolit®
Fillers: -
Ports: Qinzhou, Shekou, Shanghai, Ningbo
Delivery Terms FOB, CIF, DAP, DAT, DDP
PDF: B6oDGU_Vyncolit-E-57425.pdf
PRICE: ​Order Products​ email   sales@su-jiao.com
Wechat: WECHAT
Message
Vyncolit E 57425 is an epoxy; Epoxy resin material contains carbonyl iron powder. This product is available in North America, Africa and the Middle East, Latin America, Europe or Asia Pacific. The processing methods are: resin transfer molding, compression molding or injection molding.

The main features of Vyncolit E 57425 are:
  • chemical resistance
  • low viscosity
  • Heat resistance

Typical application areas include:
  • food contact applications
  • Electrical/electronic applications
  • military applications
General Information
Filler / Reinforcement
  • Carbonyl iron dust
Features
  • The degassing effect is low to no
  • Low viscosity
  • Solvent resistance
  • Anti-salt water/fog
  • Good thermal shock resistance
  • Good chemical resistance
  • alkali resistance
  • acid resistance
  • Non-corrosive
Uses
  • Electrical components
  • Military application
Agency Ratings
  • FDA not rated
  • USDA Unspecified Approval
Forms
  • Particles
Processing Method
  • Resin transfer molding
  • Compression molding
  • Injection molding
PhysicalNominal ValueUnitTest Method
Specific Gravity 3.20g/cm³ASTM D792
Bulk Factor 2.3ASTM D1895
Molding Shrinkage - Flow (Transfer Molded)0.30 - 0.50%ASTM D955
MechanicalNominal ValueUnitTest Method
Tensile Strength 20.7MPaASTM D638
Flexural Modulus 11000MPaASTM D790
Flexural Strength 65.5MPaASTM D790
Compressive Strength 197MPaASTM D695
ImpactNominal ValueUnitTest Method
Notched Izod Impact 21J/mASTM D256A
ThermalNominal ValueUnitTest Method
Deflection Temperature Under Load (1.8 MPa, Unannealed)232°CASTM D648
CLTE - Flow 3.4E-5cm/cm/°CASTM D696
Thermal Conductivity 1.1W/m/KASTM C177
ElectricalNominal ValueUnitTest Method
Dielectric Strength 19.8kV/mmASTM D149
Dielectric Constant (1 MHz)10.6ASTM D150
Dissipation Factor (1 MHz)0.025ASTM D150
Arc Resistance 10.0secASTM D495
InjectionNominal ValueUnit
Middle Temperature 60.0 - 82.2°C
Nozzle Temperature 82.2 - 93.3°C
Processing (Melt) Temp 104 - 116°C
Mold Temperature 135 - 177°C
Injection Pressure 34.5 - 68.9MPa
Holding Pressure 13.8 - 34.5MPa
Back Pressure 0.345MPa
Injection instructions
Gauge: 0.3The value listed as Thermal Conductivity, ASTM C177, was tested in accordance with ASTM F433.Water Absorption, ASTM D570, 48 hrs, 50°C: 0.2%Dielectric Strength, ASTM D149, 60 Hz, Method B, dry: 250 V/milDielectric Constant, ASTM D150, 1000000 Hz, dry: 10.6Dissipation Factor, ASTM D150, 1000000 Hz, dry: 0.025Bulk Factor, ASTM D1895: 2 to 2.5Compression and Transfer Molding Conditions: Preheat Temperature: 180 to 220 °F Mold Temperature: 250 to 530 °F Compression Mold Pressure: 200 to 1500 psi Transfer Mold Pressure: 100 to 2000 psi Cure Time, 0.125 in: 75 sec
Note Message
1 .Method B (step by step)
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