Category: | Phenolic , Phenolic |
Manufacturer: | SBHPP |
Trademark: | Vyncolit® |
Fillers: | - |
Ports: | Qinzhou, Shekou, Shanghai, Ningbo |
Delivery Terms | FOB, CIF, DAP, DAT, DDP |
PDF: | B0MUD3_VyncolitX651.pdf ![]() |
PRICE: | Order Products email sales@su-jiao.com |
Message |
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Vyncolit® X651 is a glass fiber and mineral filled phenolic molding compound with excellent dimensional stability and a very low coefficient of thermal expansion. |
General Information | |
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Filler / Reinforcement |
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Features |
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Agency Ratings |
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RoHS Compliance |
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Appearance |
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Processing Method |
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Part Marking Code (ISO 11469) |
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Physical | Nominal Value | Unit | Test Method |
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Density | 2.08 | g/cm³ | ISO 1183 |
Apparent Density | 1.05 | g/cm³ | ISO 60 |
Molding Shrinkage | 0.15 | % | ISO 2577 |
Water Absorption (Equilibrium, 23°C, 50% RH) | 0.15 | % | ISO 62 |
Post Shrinkage | 0.020 | % | ISO 2577 |
Mechanical | Nominal Value | Unit | Test Method |
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Flexural Strain at Break | 0.70 | % | ISO 178 |
Tensile Modulus | 25000 | MPa | ISO 527-2 |
Tensile Stress | 80.0 | MPa | ISO 527-2 |
Tensile Strain (Break) | 0.40 | % | ISO 527-2 |
Flexural Modulus | 25000 | MPa | ISO 178 |
Flexural Stress | 170 | MPa | ISO 178 |
Compressive Stress | 300 | MPa | ISO 604 |
Impact | Nominal Value | Unit | Test Method |
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Charpy Notched Impact Strength | 2.3 | kJ/m² | ISO 179 |
Charpy Unnotched Impact Strength | 7.0 | kJ/m² | ISO 179 |
Thermal | Nominal Value | Unit | Test Method |
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Heat Deflection Temperature (1.8 MPa, Unannealed) | 200 | °C | ISO 75-2/Af |
Linear thermal expansion coefficient | TMA | ||
Flow | 1.4E-5 | cm/cm/°C | TMA |
Lateral | 2.5E-5 | cm/cm/°C | TMA |
Electrical | Nominal Value | Unit | Test Method |
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Dielectric Strength | 20 | kV/mm | IEC 60243-1 |
Comparative Tracking Index | 200 | V | IEC 60112 |
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---|---|---|---|
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BMC 620M | Bulk Molding Compounds, Inc. | Polyester, TS | BMC |
Braskem PE PLURIS6301 | Braskem | LLDPE | Braskem PE |
EPO-TEK® 310M | Epoxy Technology Inc. | Epoxy | EPO-TEK® |
PHOENIX™ 8702 | Phon Tech Industrial Company | TPE | PHOENIX™ |