Order Products : sales@su-jiao.com

Kimura® K2CD

Category:	Elastomer, Specialty , Specialty Elastomer
Manufacturer:	Precision Polymer Engineering Ltd.
Trademark:	Kimura®
Fillers:	-
Ports:	Qinzhou, Shekou, Shanghai, Ningbo
Delivery Terms	FOB, CIF, DAP, DAT, DDP
PDF:	AnengQ_Kimura-K2CD.pdf
PRICE:	Order Products email sales@su-jiao.com

Wechat: WECHAT

Message
A red/brown high performance polymer containing a unique self- reinforcing polymer structure, developed specifically for aggressive semiconductor applications. The high purity of the polymer combined with the absence of any fillers makes this polymer suitable for processes involving lower feature sizes. This material has a low coefficient of thermal expansion, low compression set and has an extremely low etch rate in aggressive plasma environments. Key Attributes Exceptionally pure - does not contain any fillers which may cause particulation problems. Outstanding plasma resistance - ideal for Chlorine, Fluorine & Oxygen chemistries. Exceptionally low plasma etch rate Low thermal expansion Retro-fits existing O-ring grooves (including FKM & FFKM grooves) Low permeation Low out-gassing Low adhesion (reduced sticking) Typical Applications Dynamic seals Static seals Wafer-handling products

Message

A red/brown high performance polymer containing a unique self- reinforcing polymer structure, developed specifically for aggressive semiconductor applications. The high purity of the polymer combined with the absence of any fillers makes this polymer suitable for processes involving lower feature sizes. This material has a low coefficient of thermal expansion, low compression set and has an extremely low etch rate in aggressive plasma environments.

Key Attributes

Exceptionally pure - does not contain any fillers which may cause particulation problems.

Outstanding plasma resistance - ideal for Chlorine, Fluorine & Oxygen chemistries.

Exceptionally low plasma etch rate

Low thermal expansion

Retro-fits existing O-ring grooves (including FKM & FFKM grooves)

Low permeation

Low out-gassing

Low adhesion (reduced sticking)

Typical Applications

Dynamic seals

Static seals

Wafer-handling products

General Information
Features	The degassing effect is low to no High purity Low CLTE Low compressive deformability
Uses	Electrical/Electronic Applications Valve/valve components Seals Accessories
Appearance	Brown Red

Hardness	Nominal Value		Test Method
Durometer Hardness (Shore A)	68		ASTM D2240, ISO 7619
IRHD Hardness	67		ASTM D1415, ISO 48

Elastomers	Nominal Value	Unit	Test Method
Tensile Stress (100% Strain)	8.00	MPa	ASTM D412, ISO 37
Tensile Strength (Yield)	17.0	MPa	ASTM D412, ISO 37
Tensile Elongation (Break)	170	%	ASTM D412, ISO 37
Compression Set (204°C, 72 hr)	15	%	ASTM D395, ISO 815

Thermal	Nominal Value	Unit
Maximum Operating Temperature	300	°C
Coefficient of Linear Thermal Expansion	2.45E-4

Additional Information
Minimum Operating Temperature: -15°C (+5°F)

Resin Grade	Manufacturer	Category	Trademark
Borcom™ BG055AI	Borealis AG	PP, Unspecified	Borcom™
APEX® 3202-65NT	Teknor Apex Company	PVC, Flexible	APEX®
Devcon HV Tile Adhesive	Devcon	Epoxy	Devcon
Flexathene® TP4120BK	LyondellBasell Industries	Polyolefin, Unspecified	Flexathene®
Sylvin 9077-82C Black	Sylvin Technologies Incorporated	PVC, Unspecified	Sylvin