| Category: | MAH-g , Maleic Anhydride Grafted Polymer |
| Manufacturer: | Cytec Industries Inc. |
| Trademark: | HTM® |
| Fillers: | - |
| Ports: | Qinzhou, Shekou, Shanghai, Ningbo |
| Delivery Terms | FOB, CIF, DAP, DAT, DDP |
| PDF: | Ah0yEp_HTM-552.pdf |
| PRICE: | Order Products email sales@su-jiao.com |
| Message |
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| HTM® 552 is a bismaleimide resin matrix formulation that combines high temperature end-use performance with good handleability during lay-up HTM552 has been developed for use in structures where critical load-bearing performance is required at temperatures greater than 200°C (392°F). In applications where components may be lightly loaded, intermittent periods at 250°C (482°F) can be sustained HTM552 is also capable of enduring very short-term exposure to a temperature of 280°C (536°F). |
| General Information | |
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| Features |
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| Physical | Nominal Value | Unit | |
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| Specific Gravity 1 | 1.21 | g/cm³ |
| Note Message | |
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| 1 . | Cured resin |
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|---|---|---|---|
| Prime 6600 NAT | Prime PVC® | PVC, Rigid | Prime |
| REPOL® AS030N | Reliance Industries Limited | PP Homopolymer | REPOL® |
| TOTAL Polystyrene 815 | TOTAL Refining & Chemicals | PS (HIPS) | TOTAL Polystyrene |
| DIAMALOY ENGINEERED ALLOYS PC/PBT 627 | Network Polymers, Inc. | PC+PBT | DIAMALOY ENGINEERED ALLOYS |
| LEXAN™ FXD1414T resin | SABIC Innovative Plastics Asia Pacific | PC | LEXAN™ |