Plaskon SMT-B-2 Datasheet,Epoxy,Cookson Electronics - Semiconductor Products-SHANGHAI SUSHENG

Message
This material is an epoxy molding compound for high temperature, lead-free reflow. It is designed to withstand more demanding requirements in moisture performance, occasioned by the higher IR reflow temperatures required for processing lead-free packages. It is a highly filled, multifunctional resin designed to pass JEDEC Level 3 at 260°C IR reflow temperatures.

General Information
Features	Semi-conductive Low (to no) lead content Low hygroscopicity Fast curing Good formability Heat resistance, high
Forms	Liquid
Processing Method	Resin transfer molding

Physical	Nominal Value	Unit	Test Method
Specific Gravity	1.94	g/cm³	ASTM D792

Mechanical	Nominal Value	Unit	Test Method
Flexural Modulus			ASTM D790
22°C	1.81	MPa	ASTM D790
240°C	0.177	MPa	ASTM D790
Flexural Strength			ASTM D790
22°C	0.0103	MPa	ASTM D790
240°C	0.00216	MPa	ASTM D790

Thermal	Nominal Value	Unit	Test Method
Glass Transition Temperature	170	°C	ASTM E1356
CLTE - Flow	1.0E-5	cm/cm/°C	ASTM D696
Thermal Conductivity	0.70	W/m/K	ASTM C177

Electrical	Nominal Value	Unit	Test Method
Volume Resistivity	1.0E+15	ohms·cm	ASTM D257
Dielectric Strength	16	kV/mm	ASTM D149
Dielectric Constant (1 kHz)	4.00		ASTM D150

Flammability	Nominal Value	Unit	Test Method
Flame Rating (3.18 mm)	V-0		UL 94

Additional Information
Recommended Storage Temperature: <5°CLife @ 5°C, defined as not more than 40% loss of spiral flow based on original values.: 24 monthsLife @ 22°C, defined as not more than 40% loss of spiral flow based on original values.: 8 daysLife @ 35°C, defined as not more than 40% loss of spiral flow based on original values.: 2 daysSpiral Flow, 175°C, 1000 psi: 140 cmShimadzu Viscosity, 175°C, 1000 psi: 55 poiseRam Follower Gel Time, 175°C, 1000 psi: 18 secAsh Content: 85.5 %Hydrolyzable Halides: <1 ppmMoisture Absorption, 85°C/85%RH, 168 hrs: 0.35%Cull Hot Hardness, Shore D: 75Volume Resistivity, 22°C: 1e15 ohm-cmVolume Resistivity, 150°C: 1e12 ohm-cmAll test specimens are transfer molded and post cured for 4 hours at 175°C Linear Thermal Expansion, Alpha 1: 10 cm^-6/cm/°C Linear Thermal Expansion, Alpha 2: 50 cm^-6/cm/°C

Additional Information

Recommended Storage Temperature: <5°CLife @ 5°C, defined as not more than 40% loss of spiral flow based on original values.: 24 monthsLife @ 22°C, defined as not more than 40% loss of spiral flow based on original values.: 8 daysLife @ 35°C, defined as not more than 40% loss of spiral flow based on original values.: 2 daysSpiral Flow, 175°C, 1000 psi: 140 cmShimadzu Viscosity, 175°C, 1000 psi: 55 poiseRam Follower Gel Time, 175°C, 1000 psi: 18 secAsh Content: 85.5 %Hydrolyzable Halides: <1 ppmMoisture Absorption, 85°C/85%RH, 168 hrs: 0.35%Cull Hot Hardness, Shore D: 75Volume Resistivity, 22°C: 1e15 ohm-cmVolume Resistivity, 150°C: 1e12 ohm-cmAll test specimens are transfer molded and post cured for 4 hours at 175°C Linear Thermal Expansion, Alpha 1: 10 cm^-6/cm/°C Linear Thermal Expansion, Alpha 2: 50 cm^-6/cm/°C

Injection instructions
Resin Transfer Molding: Molding Temperature: 170 to 185°C Molding Pressure: 750 to 1250 psi In Mold Cure Time: 70 to 120 sec Post Mold Cure Time, 175°C: 0 to 3 hr

Category:	Epoxy , Epoxy; Epoxide
Manufacturer:	Cookson Electronics - Semiconductor Products
Trademark:	Plaskon
Fillers:	-
Ports:	Qinzhou, Shekou, Shanghai, Ningbo
Delivery Terms	FOB, CIF, DAP, DAT, DDP
PDF:	9gsS2L_Plaskon-SMT-B-2.pdf
PRICE:	Order Products email sales@su-jiao.com

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