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Sumikon® EME-6300HK
| Category: | Epoxy , Epoxy; Epoxide |
| Manufacturer: | Sumitomo Bakelite Co., Ltd. |
| Trademark: | Sumikon® |
| Fillers: | - |
| Ports: | Qinzhou, Shekou, Shanghai, Ningbo |
| Delivery Terms | FOB, CIF, DAP, DAT, DDP |
| PDF: | 96dLeZ_Sumikon-EME-6300HK.pdf  |
| PRICE: | Order Products email sales@su-jiao.com |
Wechat:
| Message |
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| Sumikon®EME-6300HK is an epoxy; Epoxy resin products,. It can be processed by encapsulation and is available in North America. The main characteristics are: high purity. |
| General Information | |
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| Processing Method |
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| Physical | Nominal Value | Unit | Test Method |
|---|---|---|---|
| Specific Gravity | 1.82 | g/cm³ | ASTM D792 |
| Water Absorption (24 hr) | 0.30 | % | ASTM D570 |
| Mechanical | Nominal Value | Unit | Test Method |
|---|---|---|---|
| Flexural Modulus (25°C) | 11800 | MPa | ASTM D790 |
| Flexural Strength (25°C) | 118 | MPa | ASTM D790 |
| Thermal | Nominal Value | Unit | Test Method |
|---|---|---|---|
| Glass Transition Temperature | 165 | °C | ASTM E1356 |
| Thermal Conductivity | 0.67 | W/m/K | ASTM C177 |
| Electrical | Nominal Value | Unit | Test Method |
|---|---|---|---|
| Volume Resistivity | 1.0E+13 | ohms·cm | ASTM D257 |
| Thermoset | Nominal Value | Unit | |
|---|---|---|---|
| Demold Time (180°C) | 0.75 - 1.2 | min | |
| Post Cure Time (175°C) | 4.0 - 10 | hr |
| Additional Information |
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| Spiral Flow, SB-U-03-003: 90 cmGel Time, SB-U-03-005, 175°C: 28 secThermal Expansion, SB-U-02-002, T |
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| DEXFLEX® E1800 | LyondellBasell Industries | TPO (POE) | DEXFLEX® |
| Iupilon® GPN2020DF | Mitsubishi Engineering-Plastics Corp | PC | Iupilon® |
| LNP™ THERMOCOMP™ DF0049 compound | SABIC Innovative Plastics | PC | LNP™ THERMOCOMP™ |
